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Adaptation of Enhanced TSV Capacitance as Membrane Property in 3D Brain-inspired Computing System

Authors:

M. Amimul Ehsan,

Yang YiAuthors Info & Claims

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

Article No.: 86, Pages 1 - 6

https://doi.org/10.1145/3061639.3062196

Published: 18 June 2017 Publication History

Abstract

Neurophysiological architecture using 3D integration technology offers a high device interconnection density as well as fast and energy efficient links among the neuron and synapses layers. In this paper, we propose to reconfigure the Through-Silicon-Vias (TSVs) to serve as the neuronal membrane capacitors that map the membrane electrical activities in a hybrid 3D neuromorphic system. We also investigate new methodology that could significantly enhance the TSV capacitance to achieve a high efficiency of signal processing through membrane. An optimal CAD framework is designed to optimally utilize such TSV devices, and resolve the signal-integrity issues arising at fast data rates during massively parallel data transmissions. The electrical performance of the 3D neuromorphic chip is compared against the ones of the 2D counterpart design to demonstrate the advantages of our design and methodology.

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Cited By

Ikechukwu ODang KAbdallah A(2021)On the Design of a Fault-Tolerant Scalable Three Dimensional NoC-Based Digital Neuromorphic System With On-Chip LearningIEEE Access10.1109/ACCESS.2021.30710899(64331-64345)Online publication date: 2021
https://doi.org/10.1109/ACCESS.2021.3071089
Liu SYi Y(2020)Quantized Neural Networks and Neuromorphic Computing for Embedded SystemsIntelligent System and Computing [Working Title]10.5772/intechopen.91835Online publication date: 30-Mar-2020
https://doi.org/10.5772/intechopen.91835
An HBai KYi Y(2018)The Roadmap to Realize Memristive Three-Dimensional Neuromorphic Computing SystemAdvances in Memristor Neural Networks - Modeling and Applications10.5772/intechopen.78986Online publication date: 3-Oct-2018
https://doi.org/10.5772/intechopen.78986
Show More Cited By

Adaptation of Enhanced TSV Capacitance as Membrane Property in 3D Brain-inspired Computing System
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cover image ACM Conferences

DAC '17: Proceedings of the 54th Annual Design Automation Conference 2017

June 2017

533 pages

ISBN:9781450349277

DOI:10.1145/3061639

Copyright © 2017 ACM.

Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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EDAC: Electronic Design Automation Consortium
SIGDA: ACM Special Interest Group on Design Automation
IEEE-CEDA

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SIGBED: ACM Special Interest Group on Embedded Systems

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Association for Computing Machinery

New York, NY, United States

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Published: 18 June 2017

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DAC '17

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DAC '17: The 54th Annual Design Automation Conference 2017

June 18 - 22, 2017

TX, Austin, USA

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Overall Acceptance Rate 1,770 of 5,499 submissions, 32%

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Cited By

Ikechukwu ODang KAbdallah A(2021)On the Design of a Fault-Tolerant Scalable Three Dimensional NoC-Based Digital Neuromorphic System With On-Chip LearningIEEE Access10.1109/ACCESS.2021.30710899(64331-64345)Online publication date: 2021
https://doi.org/10.1109/ACCESS.2021.3071089
Liu SYi Y(2020)Quantized Neural Networks and Neuromorphic Computing for Embedded SystemsIntelligent System and Computing [Working Title]10.5772/intechopen.91835Online publication date: 30-Mar-2020
https://doi.org/10.5772/intechopen.91835
An HBai KYi Y(2018)The Roadmap to Realize Memristive Three-Dimensional Neuromorphic Computing SystemAdvances in Memristor Neural Networks - Modeling and Applications10.5772/intechopen.78986Online publication date: 3-Oct-2018
https://doi.org/10.5772/intechopen.78986
Ehsan MAn HZhou ZYi Y(2018)A Novel Approach for Using TSVs As Membrane Capacitance in Neuromorphic 3-D ICIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2017.276050637:8(1640-1653)Online publication date: Aug-2018
https://doi.org/10.1109/TCAD.2017.2760506

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