BibTeX record journals/mr/AppeltTCL11

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@article{DBLP:journals/mr/AppeltTCL11,
  author       = {Bernd K. Appelt and
                  Andy Tseng and
                  Chun{-}Hsiung Chen and
                  Yi{-}Shao Lai},
  title        = {Fine pitch copper wire bonding in high volume production},
  journal      = {Microelectron. Reliab.},
  volume       = {51},
  number       = {1},
  pages        = {13--20},
  year         = {2011},
  url          = {https://doi.org/10.1016/j.microrel.2010.06.006},
  doi          = {10.1016/J.MICROREL.2010.06.006},
  timestamp    = {Sat, 22 Feb 2020 19:28:22 +0100},
  biburl       = {https://dblp.org/rec/journals/mr/AppeltTCL11.bib},
  bibsource    = {dblp computer science bibliography, https://dblp.org}
}

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