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"High Thermal Conductivity AlN Films for Advanced 3D Chiplets."

T. Takagi et al. (2024)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46783.2024.10631317

access: closed

type: Conference or Workshop Paper

metadata version: 2024-10-17

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  dblp key:
  - conf/vlsit/TakagiNNOMSNFMK24
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  - https://dblp.org/rec/conf/vlsit/TakagiNNOMSNFMK24
T. Takagi, T. Ninomiya, M. Niwa, S. Obara, T. Momose, Y. Shimogaki, M. Nomura, H. Fujioka, M. Mori, T. Kuroda:
High Thermal Conductivity AlN Films for Advanced 3D Chiplets. VLSI Technology and Circuits 2024: 1-2

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