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"Thermal Reliability Considerations of Resistive Synaptic Devices for 3D ..."

Ankit Kaul et al. (2021)

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DOI: 10.1109/3DIC52383.2021.9687612

access: closed

type: Conference or Workshop Paper

metadata version: 2023-03-21

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Ankit Kaul, Yandong Luo, Xiaochen Peng, Shimeng Yu, Muhannad S. Bakir:
Thermal Reliability Considerations of Resistive Synaptic Devices for 3D CIM System Performance. 3DIC 2021: 1-5

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