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Séverine Cheramy
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2020 – today
- 2021
- [j3]Pascal Vivet
, Eric Guthmuller
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits 56(1): 79-97 (2021) - 2020
- [c17]Pascal Vivet
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm2 Inter-Chiplet Interconnects and 156mW/mm2@ 82%-Peak-Efficiency DC-DC Converters. ISSCC 2020: 46-48
2010 – 2019
- 2019
- [c16]Emilie Bourjot, Paul Stewart, Christophe Dubarry
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development. 3DIC 2019: 1-5 - [c15]Pascal Vivet
Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE 2019: 674-679 - 2018
- [c14]Eric Guthmuller
A 29 Gops/Watt 3D-Ready 16-Core Computing Fabric with Scalable Cache Coherent Architecture Using Distributed L2 and Adaptive L3 Caches. ESSCIRC 2018: 318-321 - 2017
- [j2]Pascal Vivet
A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links. IEEE J. Solid State Circuits 52(1): 33-49 (2017) - 2016
- [j1]Perceval Coudrain
Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test 33(3): 21-36 (2016) - [c13]Séverine Cheramy, Amandine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-2 - [c12]Séverine Cheramy, Amadine Jouve, Lucile Arnaud, Claire Fenouillet-Béranger, Perrine Batude, Maud Vinet:
Towards high density 3D interconnections. 3DIC 2016: 1-5 - [c11]Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau
ITAC: A complete 3D integration test platform. 3DIC 2016: 1-4 - [c10]Rafael Prieto, Perceval Coudrain
Heat spreading packaging solutions for hybrid bonded 3D-ICs. 3DIC 2016: 1-6 - [c9]Pascal Vivet
8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links. ISSCC 2016: 146-147 - 2015
- [c8]Pascal Vivet, Christian Bernard, Fabien Clermidy, Denis Dutoit, Eric Guthmuller
3D advanced integration technology for heterogeneous systems. 3DIC 2015: FS6.1-FS6.3 - [c7]Amadine Jouve, Y. Sinquin, Arnaud Garnier, M. Daval, Pascal Chausse, M. Argoud, N. Allouti, Laurence Baud, Jérôme Dechamp, R. Franiatte, Séverine Cheramy, H. Kato, K. Kondo:
Silicon based dry-films evaluation for 2.5D and 3D Wafer-Level system integration improvement. 3DIC 2015: TS1.4.1-TS1.4.8 - 2013
- [c6]Melanie Brocard, Cédric Bermond, Thierry Lacrevaz, Alexis Farcy, Patrick Le Maitre, P. Scheer, Patrick Leduc, Séverine Cheramy, Bernard Fléchet:
RF characterization of substrate coupling between TSV and MOS transistors in 3D integrated circuits. 3DIC 2013: 1-8 - [c5]Sylvain Joblot, Alexis Farcy, Nicolas Hotellier, Amadine Jouve, François de Crecy, Arnaud Garnier, M. Argoud, C. Ferrandon, J.-P. Colonna, R. Franiatte, C. Laviron, Séverine Cheramy:
Wafer level encapsulated materials evaluation for chip on wafer (CoW) approach in 2.5D Si interposer integration. 3DIC 2013: 1-7 - [c4]Yann Lamy, Jean-Philippe Colonna, G. Simon, Patrick Leduc, Séverine Cheramy, C. Laviron:
Which interconnects for which 3D applications? Status and perspectives. 3DIC 2013: 1-6 - [c3]Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain
Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC 2013: 1-6 - 2011
- [c2]G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain
3D integration demonstration of a wireless product with design partitioning. 3DIC 2011: 1-5
2000 – 2009
- 2009
- [c1]David Henry, Séverine Cheramy, Jean Charbonnier, Pascal Chausse, Muriel Neyret, Cathy Brunet-Manquat, Sophie Verrun, Nicolas Sillon, Laurent Bonnot, Xavier Gagnard, E. Saugier:
3D integration technology for set-top box application. 3DIC 2009: 1-7
Coauthor Index
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