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Antonio La Manna
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2010 – 2019
- 2015
- [c7]Dimitrios Velenis, Mikael Detalle, Geert Hellings, Mirko Scholz, Erik Jan Marinissen
, Geert Van der Plas
Processing active devices on Si interposer and impact on cost. 3DIC 2015: TS11.2.1-TS11.2.4 - [c6]Geert Hellings, Mirko Scholz, Mikael Detalle, Dimitrios Velenis, Muriel de Potter de ten Broeck, C. Roda Neve, Y. Li, Stefaan Van Huylenbroeck, Shih-Hung Chen, Erik Jan Marinissen
Active-lite interposer for 2.5 & 3D integration. VLSIC 2015: 222- - 2012
- [c5]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [c4]Yuuki Araga, Makoto Nagata
In-tier diagnosis of power domains in 3D TSV ICs. 3DIC 2011: 1-6 - [c3]Y. H. Hu, C. S. Liu, M. J. Lii, Kenneth J. Rebibis, Anne Jourdain, Antonio La Manna, Gerald Beyer, Eric Beyne
3D stacking using Cu-Cu direct bonding. 3DIC 2011: 1-4 - [c2]Andrej Ivankovic, Geert Van der Plas
Analysis of microbump induced stress effects in 3D stacked IC technologies. 3DIC 2011: 1-5 - [c1]Antonio La Manna, Dimitrios Velenis, Thibault Buisson, Mikael Detalle, Kenneth J. Rebibis, Wenqi Zhang, Eric Beyne
3D stacking using ultra thin dies. 3DIC 2011: 1-5
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