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"Young's modulus of a sintered Cu joint and its influence on thermal stress."

Toshitaka Ishizaki et al. (2017)

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DOI: 10.1016/J.MICROREL.2017.06.015

access: closed

type: Journal Article

metadata version: 2024-10-06

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  - journals/mr/IshizakiMKHUY17
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  - https://dblp.org/rec/journals/mr/IshizakiMKHUY17
Toshitaka Ishizaki, D. Miura, A. Kuno, K. Hasegawa, Masanori Usui, Y. Yamada:
Young's modulus of a sintered Cu joint and its influence on thermal stress. Microelectron. Reliab. 76-77: 405-408 (2017)

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