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"An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype ..."

Jie Zhang et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830188

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-04

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  dblp key:
  - conf/vlsit/ZhangLHLHWDCCWS22
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  - https://dblp.org/rec/conf/vlsit/ZhangLHLHWDCCWS22
Jie Zhang, Wei Lu, Po-Tsang Huang, Sih-Han Li, Tsung-Yi Hung, Shih-Hsien Wu, Ming-Ji Dai, I-Shan Chung, Wen-Chao Chen, Chin-Hung Wang, Shyh-Shyuan Sheu, Hung-Ming Chen, Kuan-Neng Chen, Wei-Chung Lo, Chih-I Wu:
An Embedded Multi-Die Active Bridge (EMAB) Chip for Rapid-Prototype Programmable 2.5D/3D Packaging Technology. VLSI Technology and Circuits 2022: 262-263

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