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"Fracture analysis on die attach adhesives for stacked packages based on ..."

Huai-Hui Ren, Xi-Shu Wang, Su Jia (2013)

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DOI: 10.1016/J.MICROREL.2013.04.001

access: closed

type: Journal Article

metadata version: 2020-02-22

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Huai-Hui Ren, Xi-Shu Wang, Su Jia:
Fracture analysis on die attach adhesives for stacked packages based on in-situ testing and cohesive zone model. Microelectron. Reliab. 53(7): 1021-1028 (2013)

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