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"Effect of isothermal aging and low density current on intermetallic ..."

Jun Shen et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.09.005

access: closed

type: Journal Article

metadata version: 2024-10-06

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  - https://dblp.org/rec/journals/mr/ShenCZZH14
Jun Shen, Zhongming Cao, Dajun Zhai, Mali Zhao, Peipei He:
Effect of isothermal aging and low density current on intermetallic compound growth rate in lead-free solder interface. Microelectron. Reliab. 54(1): 252-258 (2014)

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