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"Prediction of thermo-mechanical integrity of wafer backend processes."

Viktor Gonda et al. (2004)

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DOI: 10.1016/J.MICROREL.2004.05.021

access: closed

type: Journal Article

metadata version: 2023-09-30

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Viktor Gonda, Jaap M. J. den Toonder, Johan Beijer, G. Q. Zhang, Willem D. van Driel, Romano J. O. M. Hoofman, Leo J. Ernst:
Prediction of thermo-mechanical integrity of wafer backend processes. Microelectron. Reliab. 44(12): 2011-2017 (2004)

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