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"Vibration reliability test and finite element analysis for flip chip ..."

F. X. Che, John H. L. Pang (2009)

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DOI: 10.1016/J.MICROREL.2009.03.022

access: closed

type: Journal Article

metadata version: 2023-09-30

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F. X. Che, John H. L. Pang:
Vibration reliability test and finite element analysis for flip chip solder joints. Microelectron. Reliab. 49(7): 754-760 (2009)

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