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"Multiscale simulations of copper electrodeposition onto a resistive substrate."

Timothy O. Drews et al. (2005)

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DOI: —

access: closed

type: Journal Article

metadata version: 2021-07-06

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  dblp key:
  - journals/ibmrd/DrewsKAGBA05
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  persistent URL:
  - https://dblp.org/rec/journals/ibmrd/DrewsKAGBA05
Timothy O. Drews, Sriram Krishnan, Jay Alameda, Dennis Gannon, Richard D. Braatz, Richard C. Alkire:
Multiscale simulations of copper electrodeposition onto a resistive substrate. IBM J. Res. Dev. 49(1): 49-64 (2005)

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