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"A Tetrahedron-Based Heat Flux Signature for Cortical Thickness Morphometry ..."

Yonghui Fan et al. (2018)

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DOI: 10.1007/978-3-030-00931-1_48

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-22

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  - conf/miccai/FanWLW18
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Yonghui Fan, Gang Wang, Natasha Leporé, Yalin Wang:
A Tetrahedron-Based Heat Flux Signature for Cortical Thickness Morphometry Analysis. MICCAI (3) 2018: 420-428

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