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"RePAIR: A ReRAM-based Processing-in-Memory Accelerator for Indel Realignment."

Ting Wu et al. (2022)

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DOI: 10.23919/DATE54114.2022.9774715

access: closed

type: Conference or Workshop Paper

metadata version: 2022-05-25

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  dblp key:
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Ting Wu, Chin-Fu Nien, Kuang-Chao Chou, Hsiang-Yun Cheng:
RePAIR: A ReRAM-based Processing-in-Memory Accelerator for Indel Realignment. DATE 2022: 400-405

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