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"Achieving low temperature Cu to Cu diffusion bonding with self assembly ..."

Dau Fatt Lim et al. (2009)

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DOI: 10.1109/3DIC.2009.5306545

access: closed

type: Conference or Workshop Paper

metadata version: 2021-10-14

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Dau Fatt Lim, Shiv Govind Singh, Xiao Fang Ang, Jun Wei, Chee Mang Ng, Chuan Seng Tan:
Achieving low temperature Cu to Cu diffusion bonding with self assembly monolayer (SAM) passivation. 3DIC 2009: 1-5

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