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"Novel inter layer dielectric and thermal TSV material for enhanced heat ..."

Kumail Khurram et al. (2016)

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DOI: 10.1109/3DIC.2016.7970005

access: closed

type: Conference or Workshop Paper

metadata version: 2020-10-25

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Kumail Khurram, Asisa Kumar Panigrahi, Satish Bonam, Om Krishan Singh, Shiv Govind Singh:
Novel inter layer dielectric and thermal TSV material for enhanced heat mitigation in 3-D IC. 3DIC 2016: 1-4

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