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"Analysis of thermal stress distribution for TSV with novel structure."

Wei Feng et al. (2014)

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DOI: 10.1109/3DIC.2014.7152168

access: closed

type: Conference or Workshop Paper

metadata version: 2017-05-21

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  dblp key:
  - conf/3dic/FengWSKA14
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Wei Feng, Naoya Watanabe, Haruo Shimamoto, Katsuya Kikuchi, Masahiro Aoyagi:
Analysis of thermal stress distribution for TSV with novel structure. 3DIC 2014: 1-4

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