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Yuki Ohara
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2010 – 2019
- 2011
- [c9]Takafumi Fukushima
, Yuki Ohara, Jichoel Bea, Mariappan Murugesan, Kang Wook Lee, Tetsu Tanaka
Temporary bonding strength control for self-assembly-based 3D integration. 3DIC 2011: 1-4 - [c8]Kang Wook Lee, Jichoel Bea, Takafumi Fukushima
High reliable and fine size of 5-μm diameter backside Cu through-silicon Via(TSV) for high reliability and high-end 3-D LSIs. 3DIC 2011: 1-4 - [c7]Yuki Ohara, Kang Wook Lee, Takafumi Fukushima
Novel detachable bonding process with wettability control of bonding surface for versatile chip-level 3D integration. 3DIC 2011: 1-4 - 2010
- [c6]Mariappan Murugesan, Yuki Ohara, Jichoel Bea, Kang Wook Lee, Takafumi Fukushima
Impact of microbump induced stress in thinned 3D-LSIs after wafer bonding. 3DIC 2010: 1-5
2000 – 2009
- 2009
- [c5]Ji Chel Bea, Mariappan Murugesan, Yuki Ohara, Akihiro Noriki
Micro-Raman spectroscopy analysis and capacitance - time (C-t) measurement of thinned silicon substrates for 3D integration. 3DIC 2009: 1-5 - [c4]Yoshiyuki Kaiho, Yuki Ohara, Hirotaka Takeshita, Kouji Kiyoyama, Kang Wook Lee, Tetsu Tanaka
3D integration technology for 3D stacked retinal chip. 3DIC 2009: 1-4 - [c3]Kouji Kiyoyama, Yuki Ohara, Kang Wook Lee, Y. Yang, Takafumi Fukushima
A parallel ADC for high-speed CMOS image processing system with 3D structure. 3DIC 2009: 1-4 - [c2]Kang Wook Lee, Shigeyuki Kanno, Yuki Ohara, Kouji Kiyoyama, Ji Chel Bea, Takafumi Fukushima
Heterogeneous integration technology for MEMS-LSI multi-chip module. 3DIC 2009: 1-6 - [c1]Yuki Ohara, Akihiro Noriki, Katsuyuki Sakuma
10 µm fine pitch Cu/Sn micro-bumps for 3-D super-chip stack. 3DIC 2009: 1-6
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