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Tianshu Hou
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2020 – today
- 2024
- [c5]Tianshu Hou, Yuan Ren, Wenyong Zhou, Can Li, Zhongrui Wang, Hai-Bao Chen, Ngai Wong:
Physics-Informed Learning for Versatile RRAM Reset and Retention Simulation. ASPDAC 2024: 746-751 - 2023
- [j5]Tianshu Hou
, Peining Zhen
Multilayer Perceptron-Based Stress Evolution Analysis Under DC Current Stressing for Multisegment Wires. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(2): 544-557 (2023) - [j4]Tianshu Hou
Analytical Post-Voiding Modeling and Efficient Characterization of EM Failure Effects Under Time-Dependent Current Stressing. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 42(12): 4959-4972 (2023) - [j3]Peining Zhen
Toward Compact Transformers for End-to-End Object Detection With Decomposed Chain Tensor Structure. IEEE Trans. Circuits Syst. Video Technol. 33(2): 872-885 (2023) - [j2]Tianshu Hou
A Deep Learning Framework for Solving Stress-based Partial Differential Equations in Electromigration Analysis. ACM Trans. Design Autom. Electr. Syst. 28(4): 57:1-57:20 (2023) - [c4]Wenyong Zhou, Yuan Ren, Jiajun Zhou, Tianshu Hou, Ngai Wong:
A Time- and Energy-Efficient CNN with Dense Connections on Memristor-Based Chips. ASICON 2023: 1-4 - 2022
- [j1]Tianshu Hou
A Space-Time Neural Network for Analysis of Stress Evolution Under DC Current Stressing. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(12): 5501-5514 (2022) - [c3]Peining Zhen, Ziyang Gao, Tianshu Hou, Yuan Cheng, Hai-Bao Chen:
Deeply Tensor Compressed Transformers for End-to-End Object Detection. AAAI 2022: 4716-4724 - [c2]Yuan Cheng, Rui Lin, Peining Zhen, Tianshu Hou, Chiu Wa Ng, Hai-Bao Chen, Hao Yu, Ngai Wong:
FASSST: Fast Attention Based Single-Stage Segmentation Net for Real-Time Instance Segmentation. WACV 2022: 2714-2722 - [i1]Tianshu Hou, Peining Zhen, Ngai Wong, Quan Chen, Guoyong Shi, Shuqi Wang, Hai-Bao Chen:
Multilayer Perceptron Based Stress Evolution Analysis under DC Current Stressing for Multi-segment Wires. CoRR abs/2205.09065 (2022) - 2020
- [c1]Zaiyong Liu, Hai-Bao Chen, Tianshu Hou:
Stress Evolution Analysis of EM-Induced Void Growth for Multi-Segment Interconnect Wires. APCCAS 2020: 62-65
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