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Emile Noothout
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- affiliation: Delft University of Technology, Netherlands
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2020 – today
- 2024
- [j12]Yannick M. Hopf
, Djalma Simões dos Santos
A Pitch-Matched High-Frame-Rate Ultrasound Imaging ASIC for Catheter-Based 3-D Probes. IEEE J. Solid State Circuits 59(2): 476-491 (2024) - [j11]Peng Guo
A 125 μ m-Pitch-Matched Transceiver ASIC With Micro-Beamforming ADC and Multi-Level Signaling for 3-D Transfontanelle Ultrasonography. IEEE J. Solid State Circuits 59(8): 2604-2617 (2024) - [c12]Nuriel N. M. Rozsa, Zhao Chen, Taehoon Kim, Peng Guo, Yannick Hopf, Jason D. Voorneveld, Djalma Simões dos Santos, Emile Noothout, Zu-Yao Chang, Chao Chen, Vincent A. Henneken, Nico de Jong, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Michiel A. P. Pertijs:
A 2000-Volumes/s 3D Ultrasound Imaging Chip with Monolithically-Integrated 11.7×23.4mm2 2048-Element CMUT Array and Arbitrary-Wave TX Beamformer. VLSI Technology and Circuits 2024: 1-2 - 2023
- [j10]Peng Guo
A Pitch-Matched Low-Noise Analog Front-End With Accurate Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. IEEE J. Solid State Circuits 58(6): 1693-1705 (2023) - [j9]Peng Guo
A 1.2-mW/Channel Pitch-Matched Transceiver ASIC Employing a Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3-D Ultrasound Imaging. IEEE J. Solid State Circuits 58(9): 2607-2618 (2023) - [c11]P. Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johannes G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Transceiver ASIC for 3D Ultrasonography with Micro-Beamforming ADCs based on Passive Boxcar Integration and a Multi-Level Datalink. VLSI Technology and Circuits 2023: 1-2 - 2022
- [j8]Yannick M. Hopf
A Pitch-Matched Transceiver ASIC With Shared Hybrid Beamforming ADC for High-Frame-Rate 3-D Intracardiac Echocardiography. IEEE J. Solid State Circuits 57(11): 3228-3242 (2022) - [j7]Djalma Simões dos Santos
A Tiled Ultrasound Matrix Transducer for Volumetric Imaging of the Carotid Artery. Sensors 22(24): 9799 (2022) - [c10]Yannick Hopf
A Pitch-Matched ASIC with Integrated 65V TX and Shared Hybrid Beamforming ADC for Catheter-Based High-Frame-Rate 3D Ultrasound Probes. ISSCC 2022: 494-496 - [c9]Peng Guo
A 1.2mW/channel 100µm-Pitch-Matched Transceiver ASIC with Boxcar-Integration-Based RX Micro-Beamformer for High-Resolution 3D Ultrasound Imaging. ISSCC 2022: 496-498 - 2021
- [j6]Douwe van Willigen
A Transceiver ASIC for a Single-Cable 64-Element Intra-Vascular Ultrasound Probe. IEEE J. Solid State Circuits 56(10): 3157-3166 (2021) - [j5]Taehoon Kim
Design of an Ultrasound Transceiver ASIC with a Switching-Artifact Reduction Technique for 3D Carotid Artery Imaging. Sensors 21(1): 150 (2021) - [c8]Peng Guo
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. ESSCIRC 2021: 163-166 - [c7]Peng Guo, Zu-Yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Nico de Jong, Martin D. Verweij, Michiel A. P. Pertijs:
A Pitch-Matched Analog Front-End with Continuous Time-Gain Compensation for High-Density Ultrasound Transducer Arrays. ESSDERC 2021: 163-166
2010 – 2019
- 2019
- [c6]Jing Li, Zhao Chen, Mingliang Tan
A 1.54mW/Element 150μm-Pitch-Matched Receiver ASIC with Element-Level SAR/Shared-Single-Slope Hybrid ADCs for Miniature 3D Ultrasound Probes. VLSI Circuits 2019: 220- - 2018
- [j4]Eunchul Kang
A Reconfigurable Ultrasound Transceiver ASIC With 24×40 Elements for 3-D Carotid Artery Imaging. IEEE J. Solid State Circuits 53(7): 2065-2075 (2018) - [j3]Mingliang Tan
A Front-End ASIC With High-Voltage Transmit Switching and Receive Digitization for 3-D Forward-Looking Intravascular Ultrasound Imaging. IEEE J. Solid State Circuits 53(8): 2284-2297 (2018) - [j2]Chao Chen
A Pitch-Matched Front-End ASIC With Integrated Subarray Beamforming ADC for Miniature 3-D Ultrasound Probes. IEEE J. Solid State Circuits 53(11): 3050-3064 (2018) - [c5]Chao Chen, Zhao Chen, Deep Bera, Emile Noothout, Zu-yao Chang, Mingliang Tan
A 0.91mW/element pitch-matched front-end ASIC with integrated subarray beamforming ADC for miniature 3D ultrasound probes. ISSCC 2018: 186-188 - 2017
- [j1]Chao Chen
A Front-End ASIC With Receive Sub-array Beamforming Integrated With a 32 × 32 PZT Matrix Transducer for 3-D Transesophageal Echocardiography. IEEE J. Solid State Circuits 52(4): 994-1006 (2017) - [c4]Mingliang Tan
A front-end ASIC with high-voltage transmit switching and receive digitization for forward-looking intravascular ultrasound. CICC 2017: 1-4 - [c3]Eunchul Kang, Qing Ding, Maysam Shabanimotlagh, Pieter Kruizinga, Zu-yao Chang, Emile Noothout, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A reconfigurable 24 × 40 element transceiver ASIC for compact 3D medical ultrasound probes. ESSCIRC 2017: 211-214 - 2016
- [c2]Chao Chen, Zhao Chen, Deep Bera, Shreyas B. Raghunathan, Maysam Shabanimotlagh, Emile Noothout, Zu-yao Chang, Jacco Ponte, Christian Prins, Hendrik J. Vos, Johan G. Bosch, Martin D. Verweij, Nico de Jong, Michiel A. P. Pertijs:
A front-end ASIC with receive sub-array beamforming integrated with a 32 × 32 PZT matrix transducer for 3-D transesophageal echocardiography. VLSI Circuits 2016: 1-2 - 2015
- [c1]Michiel A. P. Pertijs, Chao Chen, Shreyas B. Raghunathan, Zili Yu, Maysam Shabanimotlagh, Zhao Chen, Zu-yao Chang, Emile Noothout, Sandra Blaak, Jacco Ponte, Christian Prins, Hans G. Bosch, Martin D. Verweij, Nico de Jong:
Low-power receive electronics for a miniature real-time 3D ultrasound probe. IWASI 2015: 235-238
Coauthor Index
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