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Uwe Kerst
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- affiliation: TU Berlin, Department of High-Frequency and Semiconductor System Technologies, Germany
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2010 – 2019
- 2015
- [c5]Norman Dodel, Stefan Keil, Andreas Wiemhofer, Malte Kortstock, Philipp Scholz, Uwe Kerst, Roland Thewes:
A BIST structure for the evaluation of the MOSFET gate dielectric interface state density in post-processed CMOS chips. ESSCIRC 2015: 412-415 - 2014
- [j9]Philipp Scholz, Norbert Herfurth, Michael Sadowski, Ted R. Lundquist, Uwe Kerst, Christian Boit:
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm. Microelectron. Reliab. 54(9-10): 1794-1797 (2014) - 2013
- [c4]Christian Boit, Clemens Helfmeier, Uwe Kerst:
Security Risks Posed by Modern IC Debug and Diagnosis Tools. FDTC 2013: 3-11 - 2012
- [c3]Clemens Helfmeier, Christian Boit, Uwe Kerst:
On charge sensors for FIB attack detection. HOST 2012: 128-133 - 2010
- [j8]Philipp Scholz, Christian Gallrapp, Uwe Kerst, Ted R. Lundquist, Christian Boit:
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments. Microelectron. Reliab. 50(9-11): 1441-1445 (2010) - [j7]Mahyar Boostandoost, Uwe Kerst, Christian Boit:
Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC. Microelectron. Reliab. 50(9-11): 1899-1902 (2010)
2000 – 2009
- 2009
- [j6]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit:
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing. Microelectron. Reliab. 49(9-11): 1158-1164 (2009) - 2008
- [j5]Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist:
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies. IEEE Des. Test Comput. 25(3): 250-257 (2008) - [j4]Ulrike Kindereit, Christian Boit, Uwe Kerst, Steven Kasapi, Radu Ispasoiu, Roy Ng, William K. Lo:
Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology. Microelectron. Reliab. 48(8-9): 1322-1326 (2008) - 2007
- [j3]Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist:
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy. Microelectron. Reliab. 47(9-11): 1523-1528 (2007) - [c2]Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger:
Backside E-Beam Probing on Nano scale devices. ITC 2007: 1-9 - 2006
- [j2]Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit:
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node. Microelectron. Reliab. 46(9-11): 1498-1503 (2006) - 2005
- [j1]Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit:
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations. Microelectron. Reliab. 45(9-11): 1544-1549 (2005) - [c1]Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner:
Impact of back side circuit edit on active device performance in bulk silicon ICs. ITC 2005: 9
Coauthor Index
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