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Global Patent Index - EP 2511389 A4

EP 2511389 A4 20130828 - AUSTENITIC HEAT-RESISTANT ALLOY

Title (en)

AUSTENITIC HEAT-RESISTANT ALLOY

Title (de)

WÄRMEBESTÄNDIGE AUSTENITISCHE LEGIERUNG

Title (fr)

ALLIAGE AUSTÉNITIQUE RÉSISTANT À LA CHALEUR

Publication

EP 2511389 A4 20130828 (EN)

Application

EP 10835974 A 20101208

Priority

  • JP 2009279982 A 20091210
  • JP 2010071954 W 20101208

Abstract (en)

[origin: WO2011071054A1] Disclosed is an austenitic heat-resistant alloy, which contains 0.15% or less of C, 2% or less of Si, 3% or less of Mn, 40-60% of Ni, 0.03-25% of Co, 15% or more but less than 28% of Cr, 12% or less of Mo and/or less than 4% of W with the total being 0.1-12%, 0.001-0.1% of Nd, 0.0005-0.006% of B, 0.03% or less of N, 0.03% or less of O, and one or more selected from among 3% or less of Al, 3% or less of Ti and 3% or less of Nb, with the balance made up of Fe and impurities that include 0.03% or less of P and 0.01% or less of S, and which satisfies 1 = 4 × Al + 2 × Ti + Nb = 12 and P + 0.2 × Cr × B < 0.035. The austenitic heat-resistant alloy has both excellent weld cracking resistance and excellent toughness in the HAZ, while exhibiting excellent creep strength at high temperatures. Consequently, the austenitic heat-resistant alloy is suitable for use as a material for high-temperature devices such as a boiler for power generation and a chemical industry plant. The austenitic heat-resistant alloy may contain one or more elements selected from among Ca, Mg, La, Ce, Ta, Hf and Zr in a specific amount.

IPC 8 full level

C22C 19/05 (2006.01)

CPC (source: EP KR US)

C22C 19/055 (2013.01 - EP KR US); C22C 19/056 (2013.01 - KR); C22F 1/10 (2013.01 - KR)

Citation (search report)

Designated contracting state (EPC)

AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DOCDB simple family (publication)

WO 2011071054 A1 20110616; CA 2780655 A1 20110616; CA 2780655 C 20140401; CN 102686757 A 20120919; CN 102686757 B 20140212; DK 2511389 T3 20150223; EP 2511389 A1 20121017; EP 2511389 A4 20130828; EP 2511389 B1 20150211; ES 2533429 T3 20150410; JP 4697357 B1 20110608; JP WO2011071054 A1 20130422; KR 101740164 B1 20170608; KR 20120073356 A 20120704; KR 20150004918 A 20150113; KR 20150043567 A 20150422; US 2012288400 A1 20121115; US 8808473 B2 20140819

DOCDB simple family (application)

JP 2010071954 W 20101208; CA 2780655 A 20101208; CN 201080055959 A 20101208; DK 10835974 T 20101208; EP 10835974 A 20101208; ES 10835974 T 20101208; JP 2010548304 A 20101208; KR 20127013192 A 20101208; KR 20147033861 A 20101208; KR 20157009606 A 20101208; US 201213472640 A 20120516