EP 2328692 A2 20110608 - METAL AND ELECTRONIC DEVICE COATING PROCESS FOR MARINE USE AND OTHER ENVIRONMENTS
Title (en)
METAL AND ELECTRONIC DEVICE COATING PROCESS FOR MARINE USE AND OTHER ENVIRONMENTS
Title (de)
BESCHICHTUNGSVERFAHREN FÜR METALLE UND ELEKTRONISCHE GERÄTE ZUR ANWENDUNG AUF SEE UND IN ÄHNLICHEN UMGEBUNGEN
Title (fr)
PROCÉDÉ DE REVÊTEMENT DE MÉTAUX ET DE DISPOSITIFS ÉLECTRONIQUES À USAGE MARITIME ET AUTRE ENVIRONNEMENTS
Publication
Application
Priority
- US 2009001410 W 20090305
- US 10408008 A 20080416
- US 10415208 A 20080416
Abstract (en)
[origin: WO2009151492A2] The present disclosure relates, in part, to Parylene based conformal coating compositions having improved properties, e.g., improved heat transfer and durability characteristics, as well as a methods and apparatus to coat objects with these compositions, and objects coated with these compositions. In some aspects, coating compositions comprising Parylene and boron nitride are disclosed. The disclosure also includes objects (e.g., electronic equipment, textiles, etc.) having a conformal coating comprising a Parylene compound and boron nitride.
IPC 8 full level
B05D 7/24 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08L 65/04 (2006.01); C09D 5/00 (2006.01); C09D 7/61 (2018.01); C23C 16/455 (2006.01); H01L 51/52 (2006.01); H05K 3/28 (2006.01)
CPC (source: EP US)
B05D 1/60 (2013.01 - EP); C09D 5/1662 (2013.01 - EP); C09D 7/61 (2017.12 - EP US); C09D 7/69 (2017.12 - EP); C09D 165/04 (2013.01 - EP); H05K 3/284 (2013.01 - EP US); H05K 3/285 (2013.01 - EP); B05D 3/142 (2013.01 - EP); B05D 2601/20 (2013.01 - EP); C08K 3/22 (2013.01 - EP); C08K 3/28 (2013.01 - EP); C08K 3/38 (2013.01 - EP); C08L 65/04 (2013.01 - EP); H05K 1/0203 (2013.01 - EP); H05K 1/021 (2013.01 - EP); H05K 2201/0179 (2013.01 - EP); H05K 2201/0209 (2013.01 - EP); H05K 2201/09872 (2013.01 - EP)
Citation (search report)
See references of WO 2009151492A2
Citation (examination)
- US 6143647 A 20001107 - PAN CHUANBIN [US], et al
- US 7064439 B1 20060620 - BERTHOLD JOERG [DE], et al
- KR 20080088966 A 20081006 - HYNIX SEMICONDUCTOR INC [KR]
Designated contracting state (EPC)
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR
Designated extension state (EPC)
AL BA RS
DOCDB simple family (publication)
WO 2009151492 A2 20091217; WO 2009151492 A3 20100325; AU 2009258264 A1 20091217; AU 2009258264 B2 20140605; CA 2724602 A1 20091217; CN 102083550 A 20110601; CN 102083550 B 20151125; CN 105400269 A 20160316; EP 2328692 A2 20110608; KR 20110059563 A 20110602; RU 2010146453 A 20120527; RU 2539694 C2 20150127
DOCDB simple family (application)
US 2009001410 W 20090305; AU 2009258264 A 20090305; CA 2724602 A 20090305; CN 200980122498 A 20090305; CN 201510679248 A 20090305; EP 09762789 A 20090305; KR 20107025728 A 20090305; RU 2010146453 A 20090305