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Global Patent Index - EP 1694769 A1

EP 1694769 A1 20060830 - DUAL-STAGE WAFER APPLIED UNDERFILLS

Title (en)

DUAL-STAGE WAFER APPLIED UNDERFILLS

Title (de)

AUF WAFER AUFGEBRACHTE ZWEISTUFIGE UNDERFILLS

Title (fr)

AGENTS D'ENCAPSULATION APPLIQUES A UNE PLAQUETTE A DEUX ETAGES

Publication

EP 1694769 A1 20060830 (EN)

Application

EP 04754369 A 20040602

Priority

  • US 2004017749 W 20040602
  • US 52400703 P 20031121

Abstract (en)

[origin: WO2005056675A1] A 100% non-volatile, one-part liquid underfill encapsulant is disclosed for application to the active side of a large wafer or integrated circuit chip. Upon coating, the encapsulant is converted to a liquefiable, tack-free solid by exposure to radiation, particularly in the UV, visible and infrared spectrum. The underfill-coated wafer exhibits outstanding shelf aging of months without advancement of cure. The large wafer can be singulated into smaller wafer sections and stored for months after which during solder reflow assembly, the wafer connects are fixed and the underfill liquefies, flows out to a fillet and transitions to a thermoset state on heat activated crosslinking.

IPC 8 full level

C08L 33/08 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C08F 283/10 (2006.01); C08L 33/10 (2006.01); C08L 33/12 (2006.01); C08L 51/08 (2006.01); C08L 63/00 (2006.01); C09D 133/04 (2006.01); H01L 21/44 (2006.01); H01L 21/447 (2006.01); H01L 21/52 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01)

CPC (source: EP KR)

B32B 27/28 (2013.01 - KR); C08F 283/10 (2013.01 - EP); C08L 33/08 (2013.01 - KR); C08L 51/08 (2013.01 - EP); C09D 133/04 (2013.01 - EP); H01L 21/44 (2013.01 - KR); H01L 21/52 (2013.01 - KR); H01L 21/563 (2013.01 - EP); H01L 23/293 (2013.01 - EP); H01L 24/29 (2013.01 - EP); C08L 63/00 (2013.01 - EP); C08L 2312/06 (2013.01 - EP); H01L 2224/274 (2013.01 - EP); H01L 2224/73203 (2013.01 - EP); H01L 2924/01005 (2013.01 - EP); H01L 2924/01006 (2013.01 - EP); H01L 2924/01012 (2013.01 - EP); H01L 2924/01013 (2013.01 - EP); H01L 2924/01015 (2013.01 - EP); H01L 2924/01023 (2013.01 - EP); H01L 2924/01027 (2013.01 - EP); H01L 2924/01033 (2013.01 - EP); H01L 2924/01038 (2013.01 - EP); H01L 2924/01042 (2013.01 - EP); H01L 2924/01047 (2013.01 - EP); H01L 2924/01054 (2013.01 - EP); H01L 2924/01061 (2013.01 - EP); H01L 2924/01074 (2013.01 - EP); H01L 2924/01075 (2013.01 - EP); H01L 2924/01082 (2013.01 - EP); H01L 2924/01322 (2013.01 - EP); H01L 2924/10253 (2013.01 - EP); H01L 2924/14 (2013.01 - EP); H01L 2924/19041 (2013.01 - EP); H01L 2924/19043 (2013.01 - EP)

C-Set (source: EP)

  1. C08L 51/08 + C08L 2666/14
  2. C08L 51/08 + C08L 2666/02
  3. C09D 133/04 + C08L 2666/22
  4. H01L 2924/3512 + H01L 2924/00
  5. H01L 2924/10253 + H01L 2924/00

Designated contracting state (EPC)

DE

DOCDB simple family (publication)

WO 2005056675 A1 20050623; CN 1946795 A 20070411; CN 1946795 B 20100623; EP 1694769 A1 20060830; EP 1694769 A4 20070829; JP 2007515785 A 20070614; KR 100975088 B1 20100811; KR 20070000399 A 20070102

DOCDB simple family (application)

US 2004017749 W 20040602; CN 200480034404 A 20040602; EP 04754369 A 20040602; JP 2006541112 A 20040602; KR 20067009637 A 20040602