EP 0497286 A3 19930113 - GOLD PLATING BATH ADDITIVES FOR COPPER CIRCUITIZATION ON POLYIMIDE PRINTED CIRCUIT BOARDS
Title (en)
GOLD PLATING BATH ADDITIVES FOR COPPER CIRCUITIZATION ON POLYIMIDE PRINTED CIRCUIT BOARDS
Publication
Application
Priority
US 64951491 A 19910201
Abstract (en)
[origin: EP0497286A2] Disclosed is a method of fabricating a microelectronic package, especially a microelectronic package having gold plated copper circuitization on a polyimide substrate. The method includes the steps of forming a pattern of copper circuitization on the selected portions of the polyimide substrate, and thereafter depositing a gold thin film of selected portions of the copper circuitization layer. The gold thin film is electrodeposited from an electrodeposition solution of KAu(CN)2, K2HPO4, and KH2PO4, modified by the addition of an effective amount of NH4<+>. <IMAGE>
IPC 1-7
IPC 8 full level
C25D 3/48 (2006.01); H01L 21/48 (2006.01); H01L 23/12 (2006.01); H05K 3/24 (2006.01)
CPC (source: EP US)
C25D 3/48 (2013.01 - EP US); H01L 21/4846 (2013.01 - EP US); H05K 3/244 (2013.01 - EP US); Y10S 205/92 (2013.01 - EP US); Y10S 205/926 (2013.01 - EP US)
Citation (search report)
- [X] US 4962004 A 19901009 - SHYU JIEH-HWA [US]
- [A] EP 0215557 A2 19870325 - GOULD INC [US]
- [A] CH 511288 A 19710815 - ENGELHARD IND LTD [GB]
- [A] US 3617452 A 19711102 - KEITH CARL D, et al
- [XP] EP 0423947 A2 19910424 - MINNESOTA MINING & MFG [US]
Designated contracting state (EPC)
DE FR GB
DOCDB simple family (publication)
EP 0497286 A2 19920805; EP 0497286 A3 19930113; JP 2609390 B2 19970514; JP H04318186 A 19921109; US 5176811 A 19930105
DOCDB simple family (application)
EP 92101373 A 19920128; JP 715692 A 19920120; US 64951491 A 19910201