Hall Amplifier Nanoscale Device (HAND): Modeling, Simulations and Feasibility Analysis for THz Sensor
<p>Proposed structure and parameter names of the Hall Amplifier.</p> "> Figure 2
<p>Materials composing the design.</p> "> Figure 3
<p>Hall Bar geometry for the simulations.</p> "> Figure 4
<p>Mesh for three-dimensional (3D) simulation set-up.</p> "> Figure 5
<p>Mesh for two-dimensional (2D) simulation of the Hall Bar.</p> "> Figure 6
<p>Magnetic flux density norm (T) produced by 30 nm copper coil at a of distance CD = 70 nm, and with electric current input of 30 µA.</p> "> Figure 7
<p>Magnetic flux density norm (T) produced by 25 nm copper coil at varying distance CD, and this time with an electric current input of 30 mA. (<b>a</b>) CD = 80 nm; (<b>b</b>) CD = 85 nm; (<b>c</b>) CD = 90 nm; (<b>d</b>) CD = 95 nm; and, (<b>e</b>) CD = 100 nm.</p> "> Figure 8
<p>Magnetic flux density norm (T), produced by several lengths of copper coil at a distance of CD = 100 nm, and with an electric current input of 30 mA. (<b>a</b>) 15 nm copper coil; (<b>b</b>) 20 nm copper coil; (<b>c</b>) 25 nm copper coil; (<b>d</b>) 30 nm copper coil; (<b>e</b>) 35 nm copper coil; and, (<b>f</b>) 40 nm copper coil.</p> "> Figure 9
<p>Magnetic flux density norm (T), produced by 15 nm copper coil with five loops, and an input electric current of 30 µA. (<b>a</b>) Face-view; and, (<b>b</b>) Cross-view.</p> "> Figure 10
<p>Magnetic flux density norm (T), produced by 15 nm copper coil with 10 loops, and an input electric current of 30 µA. (<b>a</b>) Face-view; and, (<b>b</b>) Cross-view.</p> "> Figure 11
<p>Magnetic flux density norm (T), produced by 15 nm copper coil with 15 loops, and an input electric current of 30 µA. (<b>a</b>) Face-view; and, (<b>b</b>) Cross-view.</p> "> Figure 12
<p>Magnetic flux density norm (T), produced by 15 nm copper coil with 20 loops, and an input electric current of 30 µA. (<b>a</b>) Face-view; and, (<b>b</b>) Cross-view.</p> "> Figure 13
<p>The temperature as a function of the input electric current.</p> "> Figure 14
<p>The temperature as a function of the input electric current. The temperature with input electric current: (<b>a</b>) 30 µA; (<b>b</b>) 45 µA; and, (<b>c</b>) 55 µA.</p> "> Figure 15
<p>The temperature produced by varying lengths of copper coil and input electric current of 30 µA: (<b>a</b>) 20 nm; (<b>b</b>) 25 nm; (<b>c</b>) 30 nm; (<b>d</b>) 35 nm; and, (<b>e</b>) 40 nm.</p> "> Figure 16
<p>Simulation of the voltage difference across the Hall Bar that is caused by the perpendicular magnetic field.</p> "> Figure 17
<p>Hall Voltage as a function of the frequency in half log scale.</p> "> Figure 18
<p>Hall Voltage as a function of the frequency in half log scale for several V<sub>dd</sub> values.</p> "> Figure 19
<p>Hall Voltage as a function of the frequency for different scattering times in log-log scale.</p> "> Figure 20
<p>Hall Voltage as a function of the frequency for heterodyne Hall conductivity.</p> ">
Abstract
:1. Introduction
2. Device Structure
2.1. Nanoscale Device Concept and Advantages
2.2. Device Architecture and Design
2.3. Simulation Considerations
2.4. Mesh Accuracy and Considerations
3. Analytical Model
3.1. Classical Hall Effect
3.2. DC Hall Magneto-Resistance
3.3. Approximation to the Dynamic Magneto-Conductivity Tensor for Free Electrons
3.4. Heterodyne Hall Effect in a Two-Dimensional Electron Gas
3.5. Dielectric Tensor for Free Electron Model
4. Results
4.1. Parameters
4.2. Single Loop Copper Wire Magnetic Field
4.3. Multi-Loop Copper Wire Magnetic Field
4.4. Heat Transfer of the Device
4.5. Current Density Effect on Joule Heating
4.6. Hall Bar 2D AC/DC Simulations
4.7. Frequency Effect on Hall Voltage
4.8. The Effect of the Applied Voltage Vdd on Hall Voltage
4.9. The Effects of Scattering Time on the Hall Voltage
4.10. Heterodyne Hall Effect Simulation
5. Discussion
5.1. Accuracy
5.2. High Temperature
- Optimization of the HAND size—as we increase the electromagnet cross-section area, the larger the sustained current, the stronger the magnetic field is. However, it is important to keep HAND small enough, first in order to prevent it from losing its nanoscale advantage. In such a case, the magnetic field in the Hall Bar zone may be even weaker.
- The use of different materials—different materials may sustain higher current densities than copper, therefore it could be part of the solution to the high temperature.
- The field of superconductors—superconductors may help in producing the magnetic field we need, this time with lower generated temperatures.
- Changing the geometry and components of the HAND—increasing the loop density, as shown above in the multi-loop simulation, might help in increasing the magnetic field intensity with the same current density. Moreover, adding a ferromagnetic core may be a possible solution in order to concentrate the magnetic flux and create a more powerful magnet.
6. Conclusions
7. Patents
Author Contributions
Funding
Acknowledgments
Conflicts of Interest
References
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Parameter | Parameters Definition | Values |
---|---|---|
Device Parameters: | ||
σ2D Cu | Hall Bar Conductivity in 2D simulations | 5.998 × 107 S/m |
Σ Doped Si | Hall Bar Conductivity in heterodyne simulation | 1.04 × 103 S/m |
RH | Hall Coefficient | 8.1202 × 1011 m3/(sA) |
WB | Hall Bar Width | 50 nm |
HB | Hall Bar length | 150 nm |
TB | Hall Bar Thickness | 50 nm |
µe Cu | Electron Mobility in Copper | 48.705 cm2/(V |
µe Si | Electron Mobility in Silicon | 1400 cm2/(V [18] |
µe GaAs | Electron Mobility in Gallium Arsenide | 8500 cm2/(V [18] |
Comsol Setup Used Parameters: | ||
Bz | Magnetic field in Z direction | 0.3 T |
Τ | Scattering Time of Copper | 3.6 × 10−14 s |
τT | A variable to change the scattering time | 3.6 × 10−14 s–3.6 × 10−16 s |
Freq | Frequency | |
τ | Scattering time of silicon | 0.21 × 10−12 s |
Vdd | Applied Voltage | 1 V–5 V |
I0 | Input electric current in the Joule heating simulation | 30 µA–55 µA |
Measured Parameters: | ||
|VHall 2D| | Output Voltage in 2D AC/DC simulations | 2.1 mV |
fc.o. Cu | Cut off frequency in Copper | ~1 THz |
B | Magnetic flux density norm | Depends on simulation |
T | Temperature | Depends on simulation |
VHall Het | Resonant Output voltage in the heterodyne simulation | 45 V |
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Karsenty, A.; Mottes, R. Hall Amplifier Nanoscale Device (HAND): Modeling, Simulations and Feasibility Analysis for THz Sensor. Nanomaterials 2019, 9, 1618. https://doi.org/10.3390/nano9111618
Karsenty A, Mottes R. Hall Amplifier Nanoscale Device (HAND): Modeling, Simulations and Feasibility Analysis for THz Sensor. Nanomaterials. 2019; 9(11):1618. https://doi.org/10.3390/nano9111618
Chicago/Turabian StyleKarsenty, Avi, and Raz Mottes. 2019. "Hall Amplifier Nanoscale Device (HAND): Modeling, Simulations and Feasibility Analysis for THz Sensor" Nanomaterials 9, no. 11: 1618. https://doi.org/10.3390/nano9111618
APA StyleKarsenty, A., & Mottes, R. (2019). Hall Amplifier Nanoscale Device (HAND): Modeling, Simulations and Feasibility Analysis for THz Sensor. Nanomaterials, 9(11), 1618. https://doi.org/10.3390/nano9111618