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  • 北京元坤伟业科技有限公司

         该会员已使用本站17年以上

  • PC817X1NSZW
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  • 深圳市得捷芯城科技有限公司

     该会员已使用本站11年以上
  • PC817X1NSZW
  • 数量400 
  • 厂家SHARP/夏普 
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  • 批号23+ 
  • 优势代理渠道,原装正品,可全系列订货开增值税票
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  • 0755-82546830 QQ:3007977934QQ:3007947087
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • PC817X1NSZW
  • 数量12500 
  • 厂家SAMSUNG 
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  • 绝对原装全新正品现货/优势渠道商、原盘原包原盒
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • PC817X1NSZW(A)
  • 数量11845 
  • 厂家SHARP 夏普 
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     该会员已使用本站16年以上
  • PC817X1NSZW
  • 数量25000 
  • 厂家SHARP 
  • 封装DIP-4 
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  • 深圳市华斯顿电子科技有限公司

     该会员已使用本站16年以上
  • PC817X1NSZWM
  • 数量12500 
  • 厂家SHARP 
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  • 北京元坤伟业科技有限公司

     该会员已使用本站17年以上
  • PC817X1NSZW
  • 数量5000 
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  • 深圳市惊羽科技有限公司

     该会员已使用本站11年以上
  • PC817X1NSZW
  • 数量236000 
  • 厂家SHARP-夏普 
  • 封装DIP-4 
  • 批号▉▉:2年内 
  • ▉▉¥0.9元一有问必回一有长期订货一备货HK仓库
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  • 深圳市捷创芯微科技有限公司

     该会员已使用本站12年以上
  • PC817X1NSZW(A)
  • 数量2019 
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  • 不止网上数量 电压齐全 长期现货
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     该会员已使用本站11年以上
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  • 深圳市宇集芯电子有限公司

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  • 数量99000 
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  • 一级代理进口原装现货、假一罚十价格合理
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  • 深圳市毅创腾电子科技有限公司

     该会员已使用本站16年以上
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  • 数量20000 
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  • 数量20000 
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  • 封装DIP 
  • 批号21+ 
  • 只做原装正品,支持实单
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  • 深圳市昌和盛利电子有限公司

     该会员已使用本站11年以上
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  • 数量12568 
  • 厂家SHAPP老版 
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  • 深圳市诚达吉电子有限公司

     该会员已使用本站2年以上
  • PC817X1NSZW(A)
  • 数量5167 
  • 厂家SHARP 
  • 封装DIP-4 
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  • 15873513267 QQ:2881951980
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  • 北京天阳诚业科贸有限公司

     该会员已使用本站9年以上
  • PC817X1NSZW
  • 数量17 
  • 厂家SHARP 
  • 封装NA 
  • 批号22+ 
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  • 深圳市顺兴源微电子商行

     该会员已使用本站7年以上
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  • 数量905060010 
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  • 原装现货,低价出售
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  • 深圳市欧立现代科技有限公司

     该会员已使用本站12年以上
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  • 万三科技(深圳)有限公司

     该会员已使用本站2年以上
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  • 深圳市隆鑫创展电子有限公司

     该会员已使用本站15年以上
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  • 数量30000 
  • 厂家MICROCHIP 
  • 封装QFN32 
  • 批号2022+ 
  • 电子元器件一站式配套服务QQ:122350038
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  • 万三科技(深圳)有限公司

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  • PC817X1NSZW
  • 数量6500000 
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  • 深圳市创思克科技有限公司

     该会员已使用本站2年以上
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  • 数量8800 
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  • 全新原装原厂实力挺实单欢迎来撩
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  • 深圳市一线半导体有限公司

     该会员已使用本站11年以上
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  • 深圳市特拉特科技有限公司

     该会员已使用本站2年以上
  • PC817X1NSZW
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  • 深圳市华芯盛世科技有限公司

     该会员已使用本站13年以上
  • PC817X1NSZW
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  • 封装原厂封装 
  • 批号最新批号 
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  • 深圳市恒佳微电子有限公司

     该会员已使用本站12年以上
  • PC817X1NSZW
  • 数量30000 
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  • 封装DIP-4 
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  • 深圳市硅诺电子科技有限公司

     该会员已使用本站8年以上
  • PC817X1NSZW
  • 数量42868 
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  • 封装DIP4 
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  • 原厂指定分销商,有意请来电或QQ洽谈
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  • 上海熠富电子科技有限公司

     该会员已使用本站15年以上
  • PC817X1NSZW
  • 数量7500 
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  • 深圳市宗天技术开发有限公司

     该会员已使用本站10年以上
  • PC817X1NSZW
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     该会员已使用本站16年以上
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     该会员已使用本站11年以上
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  • 深圳市科雨电子有限公司

     该会员已使用本站9年以上
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  • 厂家SHARP 
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  • 批号24+ 
  • 原厂渠道,全新原装现货,欢迎查询!PESD5V0V1BB
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产品型号PC817X1NSZW的概述

PC817X1NSZW 芯片概述与详解 一、概述 PC817X1NSZW 是一款广泛应用于电子工程领域的光耦合器(Optocoupler),属于大规模集成电路中的一种重要类型。该芯片是由日本的赛普拉斯半导体(Cypress Semiconductor)公司研发的,其结构中包含一个发光二极管(LED)和一个光敏接收器( phototransistor),二者之间通过空气间隔进行光耦合。 光耦合器的主要功能是将电信号通过光的形式传递,从而实现电气隔离。此特性使得 PC817X1NSZW 在相对高电压和高电流的应用环境下表现出色,能够有效防止信号的干扰和电气失效。 PC817 的应用非常广泛,常见于数据采集、电机控制、电源管理和信号隔离等多种场合。特有的光耦合功能使其成为了定制电子设备和电路的理想选择,可用于信息的远程传递而不影响低压信号的稳定性。 二、详细参数 PC817X1NSZW 的...

产品型号PC817X2的Datasheet PDF文件预览

PC817X Series  
DIP 4pin General Purpose  
Photocoupler  
PC817X Series  
4-channel package type is also available.  
(model No. PC847X Series)  
Description  
PC817X Series contains an IRED optically coupled  
to a phototransistor.  
It is packaged in a 4pin DIP, available in wide-lead  
spacing option and SMT gullwing lead-form option.  
Input-output isolation voltage(rms) is 5.0kV.  
Agency approvals/Compliance  
1. Recognized by UL1577 (Double protection isolation),  
file No. E64380 (as model No. PC817)  
2. Package resin : UL flammability grade  
(94V-0)  
(*)  
Collector-emitter voltage is 80V and CTR is 50%  
to 600% at input current of 5mA.  
Applications  
1. I/O isolation for MCUs (Micro Controller Units)  
2. Noise suppression in switching circuits  
3. Signal transmission between circuits of different po-  
tentials and impedances  
Features  
1. 4pin DIP package  
2. Double transfer mold package (Ideal for Flow Solder-  
ing)  
(*)  
3. High collector-emitter voltage (VCEO:80V )  
4. Current transfer ratio (CTR : MIN. 50% at IF=5 mA,  
VCE=5V)  
5. Several CTR ranks available  
6. High isolation voltage between input and output  
(Viso(rms) : 5.0 kV)  
(*) Up to Date code "P7" (July 2002) VCEO : 35V.  
From the production Date code "J5" (May 1997) to "P7" (July  
2002), however the products were screened by BVCEO70V.  
Notice The content of data sheet is subject to change without prior notice.  
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP  
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.  
Sheet No.: D2-A03101EN  
1
Date Sep. 30. 2003  
© SHARP Corporation  
PC817X Series  
Internal Connection Diagram  
1
2
3
4
Anode  
1
4
3
Cathode  
Emitter  
Collector  
2
(Unit : mm)  
Outline Dimensions  
1. Through-Hole [ex. PC817X]  
2. SMT Gullwing Lead-Form [ex. PC817XI]  
Rank mark  
Rank mark  
Factory identification mark  
Anode mark  
Anode mark  
Factory identification mark  
Date code  
Date code  
4
1
2
4
1
2
3
PC817  
P C 8 1 7  
3
0.5  
0.5  
6.5  
6.5  
0.5  
0.3  
4.58  
0.3  
0.5  
7.62  
7.62  
4.58  
Epoxy resin  
0.25  
Epoxy resin  
+0.4  
+0.4  
2.54  
1.0  
1.0  
0  
0  
0.1  
+0  
0.26  
10.0  
0.5  
0.1  
0.5  
θ
θ
θ : 0 to 13˚  
3. Wide Through-Hole Lead-Form [ex. PC817XF]  
4. Wide SMT Gullwing Lead-Form [ex. PC817XFP]  
Rank mark  
Factory identification mark  
Rank mark  
Anode mark  
Factory identification mark  
Anode mark  
Date code  
Date code  
1
2
4
1
2
4
3
3
P C 8 1 7  
P C 8 1 7  
0.5  
6.5  
0.5  
0.3  
6.5  
0.5  
0.3  
4.58  
7.62  
0.5  
7.62  
4.58  
Epoxy resin  
10.16  
0.1  
0.5  
0.25  
0.5  
0.25  
0.75  
0.75  
Epoxy resin  
12.0MAX  
0.1  
0.1  
0.26  
0.5  
0.5  
10.16  
Product mass : approx. 0.21g  
Sheet No.: D2-A03101EN  
2
PC817X Series  
Date code (2 digit)  
1st digit  
2nd digit  
Year of production  
Month of production  
A.D.  
1990  
1991  
1992  
1993  
1994  
1995  
1996  
1997  
1998  
1999  
2000  
2001  
A.D  
2002  
2003  
2004  
2005  
2006  
2007  
2008  
2009  
2010  
2011  
2012  
Mark  
P
Month  
Mark  
1
Mark  
A
B
January  
February  
March  
R
2
S
3
C
T
April  
4
D
E
U
May  
5
F
V
June  
6
H
J
W
X
July  
7
August  
September  
October  
November  
December  
8
K
L
A
9
B
O
N
D
M
N
C
·
·
·
·
·
·
repeats in a 20 year cycle  
Factory identification mark  
Factory identification Mark  
Country of origin  
no mark  
Japan  
Indonesia  
Philippines  
China  
* This factory marking is for identification purpose only.  
Please contact the local SHARP sales representative to see the actural status of the  
production.  
Rank mark  
Refer to the Model Line-up table  
Sheet No.: D2-A03101EN  
3
PC817X Series  
Absolute Maximum Ratings  
(Ta=25˚C)  
Unit  
mA  
A
Parameter  
Symbol  
IF  
Rating  
50  
Forward current  
*1 Peak forward current  
Reverse voltage  
IFM  
1
VR  
6
V
Power dissipation  
P
70  
mW  
V
*4  
Collector-emitter voltage  
Emitter-collector voltage  
Collector current  
VCEO  
VECO  
IC  
80  
6
V
50  
mA  
mW  
mW  
kV  
Collector power dissipation  
Total power dissipation  
*2 Isolation voltage  
Operating temperature  
Storage temperature  
*3 Soldering temperature  
PC  
150  
200  
5.0  
Ptot  
Viso (rms)  
Topr  
Tstg  
Tsol  
30 to +100  
55 to +125  
260  
˚C  
˚C  
˚C  
*1 Pulse width100µs, Duty ratio : 0.001  
*2 40 to 60%RH, AC for 1minute, f=60Hz  
*3 For 10s  
*4 Up to Date code "P7" (July 2002) VCEO : 35V.  
Electro-optical Characteristics  
(Ta=25˚C)  
Parameter  
Symbol  
VF  
Conditions  
MIN.  
TYP.  
MAX.  
1.4  
3.0  
10  
Unit  
V
Forward voltage  
IF=20mA  
IFM=0.5A  
1.2  
Peak forward voltage  
Reverse current  
VFM  
IR  
V
VR=4V  
µA  
pF  
nA  
V
Terminal capacitance  
Collector dark current  
Collector-emitter breakdown voltage  
Emitter-collector breakdown voltage  
Collector current  
Ct  
V=0, f=1kHz  
30  
250  
100  
ICEO  
BVCEO  
BVECO  
IC  
VCE=50V, IF=0  
*5  
IC=0.1mA, IF=0  
80  
6
IE=10µA, IF=0  
V
IF=5mA, VCE=5V  
IF=20mA, IC=1mA  
DC500V, 40 to 60%RH  
V=0, f=1MHz  
2.5  
5×1010  
30.0  
0.2  
mA  
V
Collector-emitter saturation voltage  
Isolation resistance  
Floating capacitance  
Cut-off frequency  
VCE (sat)  
RISO  
Cf  
0.1  
1×1011  
0.6  
80  
4
1.0  
pF  
kHz  
µs  
µs  
fc  
VCE=5V, IC=2mA, RL=100, 3dB  
Rise time  
Response time  
tr  
18  
VCE=2V, IC=2mA, RL=100Ω  
Fall time  
tf  
3
18  
*5 From the production Date code "J5" (May 1997) to "P7" (July 2002), however the products were screened by BVCEO70V.  
Sheet No.: D2-A03101EN  
4
PC817X Series  
Model Line-up  
Lead Form Through-Hole Wide Through-Hole  
SMT Gullwing  
Wide SMT Gullwing  
I
[mA]  
C
Sleeve  
Taping  
2 000pcs/reel  
Rank mark  
(I =5mA, V =5V, T =25˚C)  
CE  
F
a
Package  
100pcs/sleeve  
PC817X  
PC817X1  
PC817X2  
PC817X3  
PC817X4  
PC817X5  
PC817X6  
PC817X7  
PC817X8  
PC817X9  
PC817X0  
PC817XF  
PC817XF1  
PC817XF2  
PC817XF3  
PC817XF4  
PC817XF5  
PC817XF6  
PC817XF7  
PC817XF8  
PC817XF9  
PC817XF0  
PC817XI  
with or without  
2.5 to 30.0  
4.0 to 8.0  
PC817XP  
PC817XFP  
A
B
PC817XI1  
PC817XI2  
PC817XI3  
PC817XI4  
PC817XI5  
PC817XI6  
PC817XI7  
PC817XI8  
PC817XI9  
PC817XI0  
PC817XP1  
PC817XP2  
PC817XP3  
PC817XP4  
PC817XP5  
PC817XP6  
PC817XP7  
PC817XP8  
PC817XP9  
PC817XP0  
6.5 to 13.0  
10.0 to 20.0  
15.0 to 30.0  
4.0 to 13.0  
6.5 to 20.0  
10.0 to 30.0  
4.0 to 20.0  
6.5 to 30.0  
4.0 to 30.0  
C
D
A or B  
B or C  
C or D  
A, B or C  
B, C or D  
A, B, C or D  
Model No.  
Please contact a local SHARP sales representative to inquire about production status and Lead-Free options.  
Sheet No.: D2-A03101EN  
5
PC817X Series  
Fig.2 Diode Power Dissipation vs.  
Fig.1 Forward Current vs. Ambient  
Temperature  
Ambient Temperature  
100  
50  
40  
30  
20  
80  
70  
60  
40  
20  
0
10  
0
30  
0
25  
50 55 75  
100  
125  
30  
0
25  
50 55 75  
100  
125  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.3 Collector Power Dissipation vs.  
Fig.4 Total Power Dissipation vs. Ambient  
Ambient Temperature  
250  
Temperature  
250  
200  
150  
100  
200  
150  
100  
50  
0
50  
0
30  
0
25  
50  
75  
100  
125  
30  
0
25  
50  
75  
100  
125  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.5 Peak Forward Current vs. Duty Ratio  
Fig.6 Current Transfer Ratio vs. Forward  
Current  
10 000  
800  
Pulse width100µs  
VCE=5V  
5 000  
Ta=25˚C  
Ta=25˚C  
700  
2 000  
1 000  
600  
500  
400  
300  
200  
500  
200  
100  
50  
20  
10  
5
100  
0
5
103  
2
5
102  
Duty ratio  
2
5
101  
2
5
1
0.1  
1
10  
Forward current IF (mA)  
Sheet No.: D2-A03101EN  
6
PC817X Series  
Fig.7 Forward Current vs. Forward Voltage  
Fig.8 Collector Current vs. Collector-emitter  
Voltage  
30  
500  
Ta=75˚C  
IF=30mA  
Ta=25˚C  
200  
25  
50˚C  
25˚C  
20mA  
PC (MAX.)  
100  
0˚C  
20  
25˚C  
50  
20  
10  
5
15  
10mA  
10  
5mA  
2
1
5
0
0
1
2
3
4
5
6
7
8
9
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
Collector-emitter voltage VCE (V)  
Forward voltage VF (V)  
Fig.9 Relative Current Transfer Ratio vs.  
Fig.10 Collector - emitter Saturation Voltage  
vs. Ambient Temperature  
Ambient Temperature  
150%  
0.14  
IF=20mA  
IF=1mA,VCE=5V  
IC=1mA  
0.12  
IF=5mA,VCE=5V  
0.10  
0.08  
0.06  
0.04  
100%  
50%  
0%  
0.02  
0
20  
0
20  
40  
60  
20  
0
20  
40  
60  
40  
80  
100  
40  
80  
100  
Ambient temperature Ta (˚C)  
Ambient temperature Ta (˚C)  
Fig.11 Collector Dark Current vs. Ambient  
Fig.12 Collector-emitter Saturation Voltage  
Temperature  
vs. Forward Current  
6
105  
5
VCE=50V  
Ta=25˚C  
106  
5
5
IC=0.5mA  
1mA  
107  
5
4
3mA  
5mA  
108  
5
3
7mA  
109  
5
2
1010  
5
1
0
1011  
0
5
10  
15  
30  
0
20  
40  
60  
80  
100  
Forward current IF (mA)  
Ambient temperature Ta (˚C)  
Sheet No.: D2-A03101EN  
7
PC817X Series  
Fig.14 Test Circuit for Response Time  
Fig.13 Response Time vs. Load Resistance  
500  
VCE=2V  
IC=2mA  
Ta=25˚C  
200  
100  
Input  
VCC  
RL  
Output  
tr  
tf  
50  
10%  
90%  
Input RD  
Output  
VCE  
20  
10  
5
td  
ts  
tr  
tf  
td  
2
1
ts  
Please refer to the conditions in Fig.13.  
0.5  
0.2  
0.1  
0.01  
0.1  
1
10  
50  
Load resistance RL (k)  
Fig.15 Frequency Response  
Fig.16 Test Circuit for Frequency Response  
VCC  
VCE=5V  
IC=2mA  
Ta=25˚C  
RL  
RD  
Output  
VCE  
0
100Ω  
1kΩ  
Please refer to the conditions in Fig.15.  
10  
RL=10kΩ  
20  
0.5  
1
2
5
10 20  
50 100 200 500  
Frequency f (kHz)  
Remarks : Please be aware that all data in the graph are just for reference and not for guarantee.  
Sheet No.: D2-A03101EN  
8
PC817X Series  
Design Considerations  
Design guide  
While operating at IF<1.0mA, CTR variation may increase.  
Please make design considering this fact.  
This product is not designed against irradiation and incorporates non-coherent IRED.  
Degradation  
In general, the emission of the IRED used in photocouplers will degrade over time.  
In the case of long term operation, please take the general IRED degradation (50% degradation over 5years)  
into the design consideration.  
Recommended Foot Print (reference)  
SMT Gullwing Lead-form  
Wide SMT Gullwing Lead-form  
10.2  
8.2  
2.2  
2.2  
(Unit : mm)  
For additional design assistance, please review our corresponding Optoelectronic Application Notes.  
Sheet No.: D2-A03101EN  
9
PC817X Series  
Manufacturing Guidelines  
Soldering Method  
Reflow Soldering:  
Reflow soldering should follow the temperature profile shown below.  
Soldering should not exceed the curve of temperature profile and time.  
Please don't solder more than twice.  
(˚C)  
300  
Terminal : 260˚C peak  
( package surface : 250˚C peak)  
200  
Reflow  
220˚C or more, 60s or less  
Preheat  
100  
150 to 180˚C, 120s or less  
0
0
1
2
3
4
(min)  
Flow Soldering :  
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below  
listed guidelines.  
Flow soldering should be completed below 270˚C and within 10s.  
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.  
Please don't solder more than twice.  
Hand soldering  
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.  
Please don't solder more than twice.  
Other notices  
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact  
on the junction between the device and PCB varies depending on the tooling and soldering conditions.  
Sheet No.: D2-A03101EN  
10  
PC817X Series  
Cleaning instructions  
Solvent cleaning:  
Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less  
Ultrasonic cleaning:  
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,  
size of PCB and mounting method of the device.  
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of  
mass production.  
Recommended solvent materials:  
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol  
In case the other type of solvent materials are intended to be used, please make sure they work fine in ac-  
tual using conditions since some materials may erode the packaging resin.  
Presence of ODC  
This product shall not contain the following materials.  
And they are not used in the production process for this device.  
Regulation substances:CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)  
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.  
Sheet No.: D2-A03101EN  
11  
PC817X Series  
Package specification  
Sleeve package  
1. Through-Hole or SMT Gullwing Lead-Form  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 100pcs of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
12.0  
6.7  
(Unit : mm)  
2. Wide Through-Hole Lead-Form or Wide SMT Gullwing Lead-Form  
Package materials  
Sleeve : HIPS (with anti-static material)  
Stopper : Styrene-Elastomer  
Package method  
MAX. 100pcs of products shall be packaged in a sleeve.  
Both ends shall be closed by tabbed and tabless stoppers.  
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.  
MAX. 20 sleeves in one case.  
Sleeve outline dimensions  
15.0  
6.35  
(Unit : mm)  
Sheet No.: D2-A03101EN  
12  
PC817X Series  
Tape and Reel package  
1. SMT Gullwing  
Package materials  
Carrier tape : PS  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
E
I
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
0.3  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
+0.1  
16.0  
H
7.5  
1.75  
J
8.0  
K
2.0  
4.0  
φ1.5  
0  
I
0.05  
0.1  
10.4  
0.4  
4.2  
5.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
1.5  
1.0  
0.5  
330  
e
17.5  
f
100  
g
13  
f
b
1.0  
0.5  
0.5  
a
23  
2.0  
2.0  
Direction of product insertion  
Pull-out direction  
[Packing : 2 000pcs/reel]  
Sheet No.: D2-A03101EN  
13  
PC817X Series  
2. Wide SMT Gullwing  
Package materials  
Carrier tape : PS  
Cover tape : PET (three layer system)  
Reel : PS  
Carrier tape structure and Dimensions  
F
D
J
G
C
I
E
K
Dimensions List  
(Unit : mm)  
A
B
C
D
E
F
G
0.3  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
+0.1  
24.0  
H
11.5  
I
1.75  
J
8.0  
K
2.0  
4.0  
φ1.5  
0  
0.05  
0.1  
12.4  
0.4  
4.1  
5.1  
Reel structure and Dimensions  
e
d
g
Dimensions List  
(Unit : mm)  
a
b
c
d
1.5  
1.0  
0.5  
330  
e
25.5  
f
100  
g
13  
f
b
1.0  
0.5  
0.5  
23  
2.0  
2.0  
a
Direction of product insertion  
Pull-out direction  
[Packing : 2 000pcs/reel]  
Sheet No.: D2-A03101EN  
14  
PC817X Series  
Important Notices  
· The circuit application examples in this publication are  
provided to explain representative applications of  
SHARP devices and are not intended to guarantee any  
circuit design or license any intellectual property rights.  
SHARP takes no responsibility for any problems rela-  
ted to any intellectual property right of a third party re-  
sulting from the use of SHARP's devices.  
with equipment that requires higher reliability such as:  
--- Transportation control and safety equipment (i.e.,  
aircraft, trains, automobiles, etc.)  
--- Traffic signals  
--- Gas leakage sensor breakers  
--- Alarm equipment  
--- Various safety devices, etc.  
(iii) SHARP devices shall not be used for or in connec-  
tion with equipment that requires an extremely high lev-  
el of reliability and safety such as:  
--- Space applications  
--- Telecommunication equipment [trunk lines]  
--- Nuclear power control equipment  
--- Medical and other life support equipment (e.g.,  
scuba).  
· Contact SHARP in order to obtain the latest device  
specification sheets before using any SHARP device.  
SHARP reserves the right to make changes in the spec-  
ifications, characteristics, data, materials, structure,  
and other contents described herein at any time without  
notice in order to improve design or reliability. Manufac-  
turing locations are also subject to change without no-  
tice.  
· If the SHARP devices listed in this publication fall with-  
in the scope of strategic products described in the For-  
eign Exchange and Foreign Trade Law of Japan, it is  
necessary to obtain approval to export such SHARP de-  
vices.  
· Observe the following points when using any devices  
in this publication. SHARP takes no responsibility for  
damage caused by improper use of the devices which  
does not meet the conditions and absolute maximum  
ratings to be used specified in the relevant specification  
sheet nor meet the following conditions:  
(i) The devices in this publication are designed for use  
in general electronic equipment designs such as:  
--- Personal computers  
· This publication is the proprietary product of SHARP  
and is copyrighted, with all rights reserved. Under the  
copyright laws, no part of this publication may be repro-  
duced or transmitted in any form or by any means, elec-  
tronic or mechanical, for any purpose, in whole or in  
part, without the express written permission of SHARP.  
Express written permission is also required before any  
use of this publication may be made by a third party.  
--- Office automation equipment  
--- Telecommunication equipment [terminal]  
--- Test and measurement equipment  
--- Industrial control  
--- Audio visual equipment  
--- Consumer electronics  
· Contact and consult with a SHARP representative if  
there are any questions about the contents of this pub-  
lication.  
(ii) Measures such as fail-safe function and redundant  
design should be taken to ensure reliability and safety  
when SHARP devices are used for or in connection  
Sheet No.: D2-A03101EN  
15  
配单直通车
PC817X2产品参数
型号:PC817X2
是否Rohs认证:不符合
生命周期:Obsolete
IHS 制造商:SHARP CORP
包装说明:DIP-4
Reach Compliance Code:unknown
风险等级:5.83
Is Samacsys:N
其他特性:UL RECOGNIZED
Coll-Emtr Bkdn Voltage-Min:80 V
配置:SINGLE
标称电流传输比:130%
最大暗电源:100 nA
最大正向电流:0.05 A
最大绝缘电压:5000 V
JESD-609代码:e0
元件数量:1
最高工作温度:100 °C
最低工作温度:-30 °C
光电设备类型:TRANSISTOR OUTPUT OPTOCOUPLER
端子面层:Tin/Lead (Sn/Pb)
Base Number Matches:1
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