MMSZ2V4ET1 Series
PACKAGE DIMENSIONS
SOD−123
CASE 425−04
ISSUE E
D
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
A1
1
MILLIMETERS
INCHES
DIM MIN
NOM
1.17
0.05
0.61
−−−
MAX
MIN
0.037
0.000
0.020
−−−
NOM
0.046
0.002
0.024
−−−
MAX
0.053
0.004
0.028
0.006
0.071
0.112
0.152
−−−
A
A1
b
0.94
0.00
0.51
−−−
1.35
0.10
0.71
0.15
1.80
2.84
3.86
−−−
H
E
E
c
D
1.40
2.54
3.56
1.60
2.69
3.68
−−−
0.055
0.100
0.140
0.010
0.063
0.106
0.145
−−−
E
H
E
L
0.25
L
STYLE 1:
PIN 1. CATHODE
2. ANODE
2
C
b
SOLDERING FOOTPRINT*
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
mm
inches
ǒ
Ǔ
SCALE 10:1
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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7