research-article

A new tightly-coupled transient electro-thermal simulation method for power electronics

Authors:

Quan Chen,

Wim SchoenmakerAuthors Info & Claims

2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

Pages 1 - 7

https://doi.org/10.1145/2966986.2966993

Published: 07 November 2016 Publication History

Abstract

This paper presents a new transient electro-thermal (ET) simulation method for fast 3D chip-level analysis of power electronics with field solver accuracy. The metallization stacks are meshed and solved with 3D field solver using nonlinear temperature-dependent parameters, and the active devices are modeled with nonlinear tabular compact models to avoid time-consuming TCAD simulation. The main contributions include: 1) A tightly-coupled formulation that solves the electrical and thermal systems simultaneously to enable a more natural characterization of ET interaction and faster convergence for strong ET coupling; 2) A specialized exponential-integrator-Newton-Krylov (EI-NK) transient solver to address the numerical challenges arising from the tightly-coupled ET simulation. Numerical experiments show that the proposed method outperforms the existing implicit time stepping with the Newton's method and the exponential integrator with an explicit nonlinear approximation.

6. References

[1]

M. Caliari and A. Ostermann. Implementation of exponential rosenbrock-type integrators. Applied Numerical Mathematics, 59 (3-4): 568–581, 2009.

Digital Library

Google Scholar

[2]

R. Chandra. Transient temperature analysis. In EDSSERC, Sep 2006.

Google Scholar

[3]

Q. Chen, W. Zhao, and N. Wong. Efficient matrix exponential method based on extended Krylov subspace for transient simulation of large-scale linear circuits. In Design Automation Conference (ASP-DAC), 2014 19th Asia and South Pacific, pages 262–266, Jan 2014.

Google Scholar

[4]

R. Gillon, P. Joris, H. Oprins, B. Vandevelde, A. Srinivasan, and R. Chandra. Practical chip-centric electro-thermal simulations. In 14th International Workshop on Thermal Inveatigation of ICs and Systems (THERMINIC), pages 220–223. Sep 2008.

Google Scholar

[5]

D. E. Keyes et al. Multiphysics simulations: Challenges and opportunities. International Journal of High Performance Computing Applications, 27 (1): 4–83, 2013.

Digital Library

Google Scholar

[6]

D. Knoll and D. Keyes. Jacobian-free newton-krylov methods: a survey of approaches and applications. Journal of Computational Physics, 193 (2): 357–397, 2004.

Digital Library

Google Scholar

[7]

B. Krabbenborg, A. Bosma, H. de Graaff, and A. Mouthaan. Layout to circuit extraction for three-dimensional thermal-electrical circuit simulation of device structures. 15 (7): 765–774, Jul 1996.

Google Scholar

[8]

Q. Mei, W. Schoenmaker, S. H. Weng, H. Zhuang, C. K. Cheng, and Q. Chen. An efficient transient electro-thermal simulation framework for power integrated circuits. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems. PP(99): 1-1, 2015.

Google Scholar

[9]

M. Pfost, D. Costachescu, A. Mayerhofer, M. Stecher, S. Bychikhin, D. Pogany, and E. Gornik. Accurate temperature measurements of DMOS power transistors up to thermal runaway by small embedded sensors. IEEE Transactions on Semiconductor Manufacturing, 25 (3): 294–302, Aug 2012.

Crossref

Google Scholar

[10]

W. Schoenmaker, O. Dupuis, B. De Smedt, P. Meuns, J. Ocenasek, W. Verhaegen, D. Dumlugol, and M. Pfost. Fully-coupled 3D electro-thermal field simulator for chip-level analysis of power devices. In 19th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC), pages 210–215, Sep 2013.

Google Scholar

[11]

S.-H. Weng, Q. Chen, and C.-K. Cheng. Time-domain analysis of large-scale circuits by matrix exponential method with adaptive control. 31 (8): 1180–1193, 2012.

Google Scholar

[12]

J. P. Whiteley, K. Gillow, S. J. Tavener, and A. C. Walter. Error bounds on block gaussfcseidel solutions of coupled multiphysics problems. International Journal for Numerical Methods in Engineering, 88 (12): 1219–1237, 2011.

Crossref

Google Scholar

[13]

H. Zhuang, S.-H. Weng, and C.-K. Cheng. Power grid simulation using matrix exponential method with rational Krylov subspaces. In IEEE 9th International Conference on ASIC (ASICON), pages 369–372, Oct 2013.

Google Scholar

[14]

H. Zhuang, S.-H. Weng, J.-H. Lin, and C.-K. Cheng. MATEX: A distributed framework for transient simulation of power distribution networks. In IEEE/ACM Design Automation Conference (DAC), pages 81:1–81:6, 2014.

Google Scholar

Cited By

View all

Chen Q(2022)EI-NK: A Robust Exponential Integrator Method With Singularity Removal and Newton–Raphson Iterations for Transient Nonlinear Circuit SimulationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.309874941:6(1693-1703)Online publication date: Jun-2022
https://doi.org/10.1109/TCAD.2021.3098749
Kaid AKammerer JRoqueta FHebrard L(2022)Novel method for modelling the local electro-thermal behaviour of discrete power diode using Verilog-A in a standard CAD environment2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)10.1109/EuroSimE54907.2022.9758854(1-7)Online publication date: 25-Apr-2022
https://doi.org/10.1109/EuroSimE54907.2022.9758854
Zhang MLi JYang CChen Q(2021)Deflated Restarting of Exponential Integrator Method with an Implicit Regularization for Efficient Transient Circuit SimulationElectronics10.3390/electronics1009112410:9(1124)Online publication date: 10-May-2021
https://doi.org/10.3390/electronics10091124
Show More Cited By

Index Terms

A new tightly-coupled transient electro-thermal simulation method for power electronics

Index terms have been assigned to the content through auto-classification.

Recommendations

An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits

This paper presents a new transient electro-thermal simulation method for fast 3-D chip-level analysis of power electronics with field solver accuracy. The metallization stack and substrate are meshed and solved with 3-D field solver using nonlinear ...
Electro-thermal analysis of multi-fin devices

As device dimensions shrink into the nanometer range, power and performance constraints prohibit the longevity of traditional MOS devices in circuit design. FinFETs, a quasl-planar double-gated device, has emerged as a replacement. While finFETs provide ...
Fully coupled dynamic electro-thermal simulation

Fully coupled dynamic electro-thermal simulation on chip and circuit level is presented. Temperature dependent thermal conductivity of silicon is taken into account, thus solving the nonlinear heat diffusion equation. The numerical solution is carried ...

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

2016 IEEE/ACM International Conference on Computer-Aided Design (ICCAD)

Nov 2016

946 pages

Publisher

IEEE Press

Publication History

Published: 07 November 2016

Permissions

Request permissions for this article.

Request Permissions

Qualifiers

Research-article

Contributors

Other Metrics

View Article Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

4
Total Citations
View Citations
43
Total Downloads

Downloads (Last 12 months)0
Downloads (Last 6 weeks)0

Reflects downloads up to 01 Jan 2025

Other Metrics

View Author Metrics

Citations

Cited By

View all

Chen Q(2022)EI-NK: A Robust Exponential Integrator Method With Singularity Removal and Newton–Raphson Iterations for Transient Nonlinear Circuit SimulationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2021.309874941:6(1693-1703)Online publication date: Jun-2022
https://doi.org/10.1109/TCAD.2021.3098749
Kaid AKammerer JRoqueta FHebrard L(2022)Novel method for modelling the local electro-thermal behaviour of discrete power diode using Verilog-A in a standard CAD environment2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)10.1109/EuroSimE54907.2022.9758854(1-7)Online publication date: 25-Apr-2022
https://doi.org/10.1109/EuroSimE54907.2022.9758854
Zhang MLi JYang CChen Q(2021)Deflated Restarting of Exponential Integrator Method with an Implicit Regularization for Efficient Transient Circuit SimulationElectronics10.3390/electronics1009112410:9(1124)Online publication date: 10-May-2021
https://doi.org/10.3390/electronics10091124
Wang SYuan DWang ALiu KLi HWang S(2019)Circuit-Field Coupling and Magnetic-Thermal Coupling Analysis of RRF Converter Designed With Magnetic IntegrationIEEE Transactions on Magnetics10.1109/TMAG.2019.290457255:5(1-8)Online publication date: May-2019
https://doi.org/10.1109/TMAG.2019.2904572

Abstract

6. References

Cited By

Index Terms

Recommendations

An Efficient Transient Electro-Thermal Simulation Framework for Power Integrated Circuits

Electro-thermal analysis of multi-fin devices

Fully coupled dynamic electro-thermal simulation

Comments

Information

Published In

Publisher

Publication History

Permissions

Qualifiers

Contributors

Other Metrics

Bibliometrics

Article Metrics

Other Metrics

Citations

Cited By

View options

Figures

Other

Share

Share this Publication link

Share on social media

Affiliations