[go: up one dir, main page]
More Web Proxy on the site http://driver.im/ skip to main content
10.1145/2333660.2333753acmconferencesArticle/Chapter ViewAbstractPublication PagesislpedConference Proceedingsconference-collections
research-article

Fan-speed-aware scheduling of data intensive jobs

Published: 30 July 2012 Publication History

Abstract

As server processor power densities increase, the cost of air cooling also grows resulting from higher fan speeds. Our measurements show that vibrations induced by fans in high-end servers and its rack neighbors cause a dramatic drop in hard disk bandwidth, resulting in a corresponding decrease in application performance. In this paper we quantify the performance and energy cost effects of the fan vibrations and propose a disk performance aware thermal, energy and cooling technique. Results show that we can not only meet thermal constraints, but also improve performance by 1.35x as compared to the conventional methods.

References

[1]
Quad-Core Intel Xeon Processor 5300 Series: Thermal/Mechanical Design Guidelines. 5, 22
[2]
http://ark.intel.com/products/46499/
[3]
http://products.amd.com/pages/OpteronCPUDetail.aspx?id=741
[4]
http://www.oracle.com/us/products/servers-storage/servers/sparc-enterprise/t-series/sparc-t4-processor-ds-497205.pdf
[5]
http://sine.ni.com/nips/cds/view/p/lang/en/nid/207099
[6]
http://www.tpc.org/tpch/
[7]
L. Barroso, U. Holzle, "The Datacenter as a Computer: an Introduction to the Design of Warehouse-scale Machines", 2009
[8]
US Environment Protection Agency, "Report to Congress on Server and Data Center Energy Efficiency", 2007
[9]
B. Debnath, S. Sengupta, J. Li, "FlashStore: High Throughput Persistent Key-Value Store", VLDB 2010
[10]
J. Donald, M. Martonosi, "Techniques for Multicore Thermal Management: Classification and New Exploration", ISCA 2006
[11]
J. Choi, C. Cher, H. Franke, H. H. A., Weger, and P. Bose, "Thermal-aware Task Scheduling at the System Software Level", ISLPED 2007, pp. 213--218
[12]
S. Heo, K. Barr, K. Asanovic, "Reducing Power Density through Activity Migration", ISLPED 2003, pp 217--222
[13]
A. Coskun, T. Rosing, K. Gross, "Proactive Temperature Management in MPSOCs", ISLPED 2008
[14]
I. Yeo, C. Liu, E. Kim, "Predictive Dynamic Thermal Management for Multicore Systems", DAC 2008, pp 734--739
[15]
X. Fan, C. Ellis, A. Lebeck, "Memory Controller Policies for DRAM Power Management", ISLPED 2001, pp 129--134
[16]
H. Hai, S. Kang, L. Charles, K. Tom, "Improving Energy Efficiency by Making DRAM Less Randomly Accessed", ISLPED 2005, pp. 393--398
[17]
J. Lin, H. Zheng, Z. Zhu, H. David, Z. Zhang, "Thermal Modeling And Management of DRAM Memory Systems", ISCA 2007, pp. 312--322
[18]
H. Chiueh, L. Luh, J. Draper, J. Choma, "A Novel Fully Integrated Fan Controller for Advanced Computer Systems", SSMSD 2000, pp. 191--194
[19]
Z. Wang, C. Bash, N. Tolia, M. Marwah, X. Zhu, P. Ranganathan, "Optimal Fan Speed Control For Thermal Management of Servers", IPAC 2009, pp. 1--10
[20]
R. Ayoub, R. Nath, T. Rosing, "JETC: Joint Energy Thermal and Cooling Management for Memory and CPU Subsystems in Servers", HPCA 2012
[21]
Y. Kim, J. Choi, S. Gurumurthi, A. Sivasubramaniam, "Managing Thermal Emergencies in Disk-based Storage Systems", Journal of Electronic Packaging, Transactions of the ASME, 130(4), 2008
[22]
Y.Kim, S. Gurumurthi, A. Sivasubramaniam, "Understanding the performance-temperature interactions in disk I/O of server workloads", HPCA 2006
[23]
M. Patterson, "The Effect of Data Center Temperature on Energy Efficiency", Proc. ITHERM 2008, pp. 1167--1174
[24]
R. Ayoub, T. S. Rosing, "Cool And Save: Cooling Aware Dynamic Workload Scheduling in Multisocket CPU Systems" in ASP-DAC 2009, pp. 891--896
[25]
K. Skadron, M. R. Stan, W. Huang, S. Velusamy, K. Sankaranarayanan, D. Tarjan, "Temperature-Aware Microarchitecture", ISCA 2003
[26]
S. V. Garimela, V. Singhal, D. Liu, "On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps" in Proceedings of the IEEE, vol.94, no.8, pp.1534--1548, Aug. 2006.
[27]
D. B. Tuckerman, R. F. W. Pease, "High-Performance Heat Sinking for VLSI", Electron Device Letter, IEEE, vol.2, no.5, pp.126--129, May 1981.
[28]
C. A. Soule, "Future Trend in Heat Sink Design", Electronics Cooling Magazine, 2001. http://www.electronics-cooling.com/2001/02/future-trends-in-heat-sink-design
[29]
R. E. Simons, R. C. Chu, "Application of Thermoelectric Cooling to Electronic Equipment: A Review and Analysis", Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE, vol., no., pp.1--9, 2000.
[30]
"Shouting in the Datacenter" {Video}, 2008. Retrieved Feb 25, 2012 from http://www.youtube.com/watch?v=tDacjrSCeq4
[31]
R. E. Simons, R. C. Chu, "Application of Thermoelectric Cooling to Electronic Equipment: A Review and Analysis", Semiconductor Thermal Measurement and Management Symposium, 2000. Sixteenth Annual IEEE, vol., no., pp.1--9, 2000.
[32]
J. Choi, C. Cher, H. Franke, H. H. A., Weger, and P. Bose, "Thermal-aware task scheduling at the system software level," ISLPED 2007, pp. 213--218
[33]
Y. Zhang and A. Srivastava. "Accurate temperature estimation using noisy thermal sensors", DAC 2009, pp. 472--477

Cited By

View all
  • (2024)Enhancing the Energy Efficiency with DURGA, a Novel Geographical Load Balancer2024 IEEE 24th International Symposium on Cluster, Cloud and Internet Computing Workshops (CCGridW)10.1109/CCGridW63211.2024.00029(180-190)Online publication date: 6-May-2024
  • (2019)Enhancing Two-Phase Cooling Efficiency through Thermal-Aware Workload Mapping for Power-Hungry Servers2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)10.23919/DATE.2019.8715033(66-71)Online publication date: Mar-2019
  • (2019)TEMPO: Thermal-Efficient Management of Power in High-Throughput Network Switches2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)10.1109/VLSI-DAT.2019.8741684(1-4)Online publication date: Apr-2019
  • Show More Cited By

Recommendations

Comments

Please enable JavaScript to view thecomments powered by Disqus.

Information & Contributors

Information

Published In

cover image ACM Conferences
ISLPED '12: Proceedings of the 2012 ACM/IEEE international symposium on Low power electronics and design
July 2012
438 pages
ISBN:9781450312493
DOI:10.1145/2333660
Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

Sponsors

Publisher

Association for Computing Machinery

New York, NY, United States

Publication History

Published: 30 July 2012

Permissions

Request permissions for this article.

Check for updates

Author Tags

  1. cooling
  2. disk i/o
  3. energy
  4. thermal
  5. vibration

Qualifiers

  • Research-article

Conference

ISLPED'12
Sponsor:
ISLPED'12: International Symposium on Low Power Electronics and Design
July 30 - August 1, 2012
California, Redondo Beach, USA

Acceptance Rates

Overall Acceptance Rate 398 of 1,159 submissions, 34%

Contributors

Other Metrics

Bibliometrics & Citations

Bibliometrics

Article Metrics

  • Downloads (Last 12 months)3
  • Downloads (Last 6 weeks)1
Reflects downloads up to 14 Dec 2024

Other Metrics

Citations

Cited By

View all
  • (2024)Enhancing the Energy Efficiency with DURGA, a Novel Geographical Load Balancer2024 IEEE 24th International Symposium on Cluster, Cloud and Internet Computing Workshops (CCGridW)10.1109/CCGridW63211.2024.00029(180-190)Online publication date: 6-May-2024
  • (2019)Enhancing Two-Phase Cooling Efficiency through Thermal-Aware Workload Mapping for Power-Hungry Servers2019 Design, Automation & Test in Europe Conference & Exhibition (DATE)10.23919/DATE.2019.8715033(66-71)Online publication date: Mar-2019
  • (2019)TEMPO: Thermal-Efficient Management of Power in High-Throughput Network Switches2019 International Symposium on VLSI Design, Automation and Test (VLSI-DAT)10.1109/VLSI-DAT.2019.8741684(1-4)Online publication date: Apr-2019
  • (2019)Optimal Performance-Aware Cooling on Enterprise ServersIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2018.285512238:9(1689-1702)Online publication date: Sep-2019
  • (2018)Heuristics and metaheuristics for dynamic management of computing and cooling energy in cloud data centersSoftware: Practice and Experience10.1002/spe.260348:10(1775-1804)Online publication date: 26-Jun-2018
  • (2016)Towards Joint Optimization Over ICT and Cooling Systems in Data Centre: A SurveyIEEE Communications Surveys & Tutorials10.1109/COMST.2016.254510918:3(1596-1616)Online publication date: Nov-2017
  • (2015)Joint management of processing and cooling power based on inaccurate thermal information in a stochastic real-time systemProceedings of the 23rd International Conference on Real Time and Networks Systems10.1145/2834848.2834879(45-54)Online publication date: 4-Nov-2015
  • (2015)Modeling Impact of Power- and Thermal-Aware Fans Management on Data Center Energy ConsumptionProceedings of the 2015 ACM Sixth International Conference on Future Energy Systems10.1145/2768510.2768525(253-258)Online publication date: 14-Jul-2015
  • (2015)Leakage-Aware Cooling Management for Improving Server Energy EfficiencyIEEE Transactions on Parallel and Distributed Systems10.1109/TPDS.2014.236151926:10(2764-2777)Online publication date: 1-Oct-2015
  • (2015)Systemic optimization of on-chip thermoelectric cooling2015 IEEE CPMT Symposium Japan (ICSJ)10.1109/ICSJ.2015.7357358(52-57)Online publication date: Nov-2015
  • Show More Cited By

View Options

Login options

View options

PDF

View or Download as a PDF file.

PDF

eReader

View online with eReader.

eReader

Media

Figures

Other

Tables

Share

Share

Share this Publication link

Share on social media