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A probabilistic framework to estimate full-chips subthreshold leakage power distribution considering within-die and die-to-die P-T-V variations

Published: 09 August 2004 Publication History

Abstract

This paper presents a probabilistic framework for full-chip estimation of subthreshold leakage power distribution considering both within-die and die-to-die variations in process (P), temperature (T) and supply voltage (V). The results obtained under this framework are compared to BSIM results and are found to be more accurate in comparison to those obtained from existing statistical models. Using this framework, a quantitative analysis of the relative sensitivities of subthreshold leakage to P-T-V variations has been presented. For the first time, the effects of die-to-die channel length and temperature variations on subthreshold leakage are studied in combination with all within-die variations. It has been shown that for accurate estimation of subthreshold leakage, it is important to consider die-to-die temperature variations which can significantly increase the leakage power due to electrothermal couplings between power and temperature. Furthermore, the full-chip leakage power distribution arising due to both within-die and die-to-die P-T-V is calculated, which is subsequently used to estimate the leakage constrained yield under the impact of these variations. The calculations show that the yield is significantly lowered under the impact of within-die and die-to-die process and temperature variations.

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  • (2014)Workload assignment considering NBTI degradation in multicore systemsACM Journal on Emerging Technologies in Computing Systems10.1145/253912410:1(1-22)Online publication date: 13-Jan-2014
  • (2012)Performance and Variability Trade-off With Gate-to-Source/Drain Overlap LengthIETE Journal of Research10.4103/0377-2063.9618058:2(130)Online publication date: 2012
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    cover image ACM Conferences
    ISLPED '04: Proceedings of the 2004 international symposium on Low power electronics and design
    August 2004
    414 pages
    ISBN:1581139292
    DOI:10.1145/1013235
    Permission to make digital or hard copies of all or part of this work for personal or classroom use is granted without fee provided that copies are not made or distributed for profit or commercial advantage and that copies bear this notice and the full citation on the first page. Copyrights for components of this work owned by others than ACM must be honored. Abstracting with credit is permitted. To copy otherwise, or republish, to post on servers or to redistribute to lists, requires prior specific permission and/or a fee. Request permissions from [email protected]

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    Publication History

    Published: 09 August 2004

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    Author Tags

    1. die-to-die variations
    2. electrothermal couplings
    3. process variations
    4. subthreshold leakage power distribution
    5. within-die variations
    6. yield estimation

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    ISLPED04
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    ISLPED04: International Symposium on Low Power Electronics and Design
    August 9 - 11, 2004
    California, Newport Beach, USA

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    Overall Acceptance Rate 398 of 1,159 submissions, 34%

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    Cited By

    View all
    • (2014)Workload assignment considering NBTI degradation in multicore systemsACM Journal on Emerging Technologies in Computing Systems10.1145/253912410:1(1-22)Online publication date: 13-Jan-2014
    • (2012)Performance and Variability Trade-off With Gate-to-Source/Drain Overlap LengthIETE Journal of Research10.4103/0377-2063.9618058:2(130)Online publication date: 2012
    • (2012)Statistical Timing and Power Optimization of Architecture and Device for FPGAsACM Transactions on Reconfigurable Technology and Systems10.1145/2209285.22092885:2(1-19)Online publication date: 1-Jun-2012
    • (2012)Power yield analysis under process and temperature variationsIEEE Transactions on Very Large Scale Integration (VLSI) Systems10.1109/TVLSI.2011.216353520:10(1794-1803)Online publication date: 1-Oct-2012
    • (2010)Statistical Approach for Yield Optimization for Minimum Energy Operation in Subthreshold Circuits Considering Variability IssuesIEEE Transactions on Semiconductor Manufacturing10.1109/TSM.2009.203918423:1(77-86)Online publication date: Feb-2010
    • (2010)Parameter Variation Tolerance and Error Resiliency: New Design Paradigm for the Nanoscale EraProceedings of the IEEE10.1109/JPROC.2010.205723098:10(1718-1751)Online publication date: Oct-2010
    • (2010)Statistical model for subthreshold current considering process variations2nd Asia Symposium on Quality Electronic Design (ASQED)10.1109/ASQED.2010.5548311(356-360)Online publication date: Aug-2010
    • (2010)Effect of Variations and Variation Tolerance in Logic CircuitsLow-Power Variation-Tolerant Design in Nanometer Silicon10.1007/978-1-4419-7418-1_3(83-108)Online publication date: 25-Oct-2010
    • (2009)Frequency and yield optimization using power gates in power-constrained designsProceedings of the 2009 ACM/IEEE international symposium on Low power electronics and design10.1145/1594233.1594263(121-126)Online publication date: 19-Aug-2009
    • (2009)Full-chip model for leakage-current estimation considering within-die correlationIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems10.1109/TCAD.2009.201654628:6(874-887)Online publication date: 1-Jun-2009
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