EDA solutions to new-defect detection in advanced process technologies
Abstract
For decades, EDA test generation tools for digital logic have relied on the Stuck-At fault model, despite the fact that process technologies moved forward from TTL (for which the Stuck-At fault model was originally developed) to nanometer-scale CMOS. Under pressure from their customers, especially in quality-sensitive application domains such as automotive, in recent years EDA tools have made great progress in improving their detection capabilities for new defects in advanced process technologies. For this Hot-Topic Session, we invited the three major EDA vendors to present their recent greatest innovations in hiqh-quality automatic test pattern generation, as well as their lead customers to testify of actual production results.
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Index Terms
- EDA solutions to new-defect detection in advanced process technologies
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- EDAA: European Design Automation Association
- ECSI
- EDAC: Electronic Design Automation Consortium
- SIGDA: ACM Special Interest Group on Design Automation
- IEEE CEDA
- The Russian Academy of Sciences: The Russian Academy of Sciences
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EDA Consortium
San Jose, CA, United States
Publication History
Published: 12 March 2012
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DATE '12
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- EDAA
- EDAC
- SIGDA
- The Russian Academy of Sciences
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Overall Acceptance Rate 518 of 1,794 submissions, 29%
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